— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC85XX 533MHZ 783FCPBGA
- Series:MPC85xx
- Mfr:NXP USA Inc.
- Package:Bulk,Tray
- Core Processor:PowerPC e500
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:533MHz
- Co-Processors/DSP:Security; SEC
- RAM Controllers:DDR, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:-
- Voltage - I/O:2.5V, 3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:Cryptography, Random Number Generator
- Mounting Type:Surface Mount
- Package / Case:783-BBGA, FCBGA
- Supplier Device Package:783-FCPBGA (29x29)
- Additional Interfaces:DUART, I2C, PCI
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Overview
The MPC8541EVTAJD is a PowerQUICC III integrated communications processor featuring an embedded e500 core. It operates at frequencies up to 1 GHz with a 1.3 V core supply. The device includes a 256 Kbyte L2 cache/SRAM, dual three-speed Ethernet controllers (TSEC), and PCI interfaces supporting 64-bit or dual 32-bit configurations. It integrates a security engine for IPSec and SSL/TLS processing, a DDR SDRAM controller with ECC support, and a Communications Processor Module (CPM). The component utilizes a 783-pin flip-chip plastic ball grid array package.
Feature Summary
- Integrates a high-performance e500 Book E-compatible core with dynamic power management capabilities.
- Includes a dedicated security engine supporting RSA, AES, DES, and SHA algorithms for network encryption.
- Features dual three-speed Ethernet controllers and multiple interface options including PCI and Local Bus.
- Provides on-chip memory configurable as L2 cache or SRAM with full ECC support.
Applications
- Enterprise networking equipment
- Telecommunications transmission systems
- Wireless infrastructure base stations
Procurement Notes
Verify the specific suffix 'J' against official NXP documentation to confirm package material and temperature grade specifications. Ensure compatibility with existing board layouts regarding the 783-pin FC-PBGA footprint and pin assignments. Confirm that the required voltage sequencing for VDD, GVDD, and OVDD rails aligns with system power design constraints.
Selection Notes
Select this processor for applications requiring high integration of communication peripherals and hardware security acceleration. Evaluate thermal requirements carefully, as maximum power dissipation increases significantly at higher clock speeds. Consider the availability of development tools and reference manuals for the e500 core architecture during the design phase.
Part Context
This component belongs to the PowerQUICC III family of processors designed by NXP Semiconductors. These devices are built on the scalable e500 system-on-chip platform using Power Architecture technology. The family targets demanding control plane processing tasks in data plane networks, balancing processor performance with I/O system throughput through high-speed connectivity options.
Replacement Considerations
Consult official NXP documentation for qualified replacement part numbers within the PowerQUICC III series. Verify functional equivalence regarding core architecture, peripheral sets, and pinout compatibility before substitution.
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