— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC85XX 667MHZ 783FCPBGA
- Series:MPC85xx
- Mfr:NXP USA Inc.
- Package:Bulk,Tray
- Core Processor:PowerPC e500
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:667MHz
- Co-Processors/DSP:Security; SEC
- RAM Controllers:DDR, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:-
- Voltage - I/O:2.5V, 3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:Cryptography, Random Number Generator
- Mounting Type:Surface Mount
- Package / Case:783-BBGA, FCBGA
- Supplier Device Package:783-FCPBGA (29x29)
- Additional Interfaces:DUART, I2C, PCI
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Overview
The MPC8541EVTALF is a PowerQUICC III integrated communications processor featuring an embedded e500 core. It operates with a maximum clock frequency of 166 MHz and utilizes a 783-pin flip-chip plastic ball grid array (FC-PBGA) package measuring 29 x 29 mm with a 1 mm pitch. The device supports a 64-bit external data bus width, includes integrated L1 and L2 caches, and features boundary scan capabilities. It functions within a recommended operating temperature range up to 105 °C.
Feature Summary
- Integrates a high-performance e500 Book E-compatible core with dual-issue superscalar architecture
- Includes a dedicated security engine supporting IPSec, SSL/TLS, and various encryption algorithms
- Features two three-speed Ethernet controllers and multiple PCI interface options
- Provides on-chip memory configurable as L2 cache or SRAM with full ECC support
Applications
- Networking infrastructure equipment
- Telecommunications systems
- Wireless infrastructure applications
Procurement Notes
Verify the specific ordering suffix against official NXP documentation to confirm package type, temperature grade, and lead-free status. Ensure compatibility with existing system power sequencing requirements, particularly regarding core voltage and I/O supply ramp rates. Confirm that the selected variant meets all absolute maximum ratings for storage and operational temperatures defined in the hardware specification.
Selection Notes
Select this component when a balanced combination of processing performance and integrated communication interfaces is required. The device is suitable for designs needing built-in security acceleration and flexible memory configurations. Consider the thermal characteristics and power dissipation profiles during the initial board layout phase to ensure reliable operation under maximum load conditions.
Part Context
This processor belongs to the PowerQUICC III family, designed to combine system-level support for industry-standard interfaces with embedded Power Architecture processors. It integrates system logic necessary for networking and telecommunications, offering a high level of integration to simplify circuit board design while maintaining high throughput for complex processing tasks.
Replacement Considerations
Consult official NXP documentation for confirmed substitute part numbers. Verify functional equivalence regarding pinout, voltage levels, and software compatibility before implementation.
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