MPC8541EVTAPF

Overview

The MPC8541EVTAPF is a PowerQUICC III integrated communications processor featuring a single-core 32-bit PowerPC e500 processor core. It operates at a maximum clock speed of 833 MHz and utilizes a 783-pin Flip Chip Ball Grid Array (FCBGA) package with dimensions of 29x29 mm. The device supports an operating temperature range from 0°C to 105°C. Key interface capabilities include dual three-speed Ethernet controllers, a PCI-X/PCI controller, and DDR/SDRAM memory support.

Feature Summary

• Integrates a high-performance embedded PowerPC e500 core for balanced processing and I/O throughput
• Includes a dedicated security engine supporting encryption algorithms and random number generation
• Provides multiple high-speed communication interfaces including dual Gigabit Ethernet and PCI

Applications

• Networking infrastructure equipment
• Telecommunications systems
• Wireless infrastructure applications

Procurement Notes

Verify the specific suffix 'V' indicates the extended commercial temperature range variant when sourcing replacements. Confirm package compatibility with the 783-pin FCBGA footprint. Check for RoHS compliance status as original Freescale units may differ from current NXP manufacturing standards. Ensure availability through authorized distributors due to potential end-of-life status.

Selection Notes

Select this component for designs requiring a robust embedded processor with hardware-accelerated security features. The e500 core architecture offers established software support for real-time operating systems. Consider the thermal requirements of the 105°C maximum junction temperature during PCB layout. Evaluate the need for the specific PCI and Ethernet interface counts provided by this SoC versus simpler microcontrollers.

Part Context

This part belongs to the PowerQUICC III family of integrated communications processors developed by Freescale Semiconductor, now NXP Semiconductors. The MPC8541 series combines system-level support for industry-standard interfaces with embedded Power Architecture technology. These devices are designed to simplify board design while providing high system-level bandwidth for demanding communication protocols.

Replacement Considerations

MPC8541EPXAPF