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Product Detailed Parameters
- Description:IC MPU MPC85XX 1.0GHZ 783FCBGA
- Series:MPC85xx
- Mfr:Freescale Semiconductor
- Package:Tray
- Core Processor:PowerPC e500
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:1.0GHz
- Co-Processors/DSP:Signal Processing; SPE
- RAM Controllers:DDR, DDR2, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (4)
- SATA:-
- USB:-
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:783-BBGA, FCBGA
- Supplier Device Package:783-FCBGA (29x29)
- Additional Interfaces:DUART, I2C, PCI, RapidIO
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Overview
The MPC8545VTAQGB is a microprocessor from the PowerQUICC III family, built on the scalable e500 system-on-chip platform. It features a single-core architecture with a 32-bit data bus and operates at a maximum clock frequency of 1 GHz. The device utilizes an FC-PBGA-783 package and supports I/O voltages of 2.5 V and 3.3 V. It includes L1 instruction and data caches of 32 kB each, along with 256 kB of L2 cache. The processor is designed for enterprise networking, telecom transmission, and wireless infrastructure applications.
Feature Summary
- Integrates high-speed connectivity options including Gigabit Ethernet, Serial RapidIO, and PCI Express interfaces.
- Features an integrated DDR2 memory controller to support scalable system performance.
- Includes security engines supporting algorithms required for 3G wireless infrastructure.
Applications
- Enterprise networking systems
- Telecom transmission and switching equipment
- 3G wireless infrastructure
Procurement Notes
Verify component authenticity through authorized NXP Semiconductors channels or certified distributors. Confirm that the part matches the specific MPC8545VTAQGB designation and packaging details. Ensure compliance with relevant RoHS directives and check for any end-of-life status updates prior to procurement.
Selection Notes
Select this component for designs requiring gigahertz-class processing within the PowerQUICC III ecosystem. Evaluate thermal management requirements for the 783-pin BGA package. Ensure the design supports the necessary 2.5 V and 3.3 V I/O voltage levels and integrates compatible DDR2 memory solutions.
Part Context
This processor belongs to the PowerQUICC III series developed by Freescale Semiconductor (now NXP). These devices utilize 90nm silicon-on-insulator technology to balance processor performance with I/O throughput. The MPC8545 variant serves as a mid-range solution within the family, offering robust connectivity for control plane processing tasks in communication networks.
Replacement Considerations
Consult official documentation for qualified substitutes such as the MPC8548E or MPC8547E. Verify pinout compatibility and functional equivalence before replacing the component in existing hardware designs.
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