MPF5023CVNA0ESR2

MPF5023CVNA0ESR2

$2.89
  • Description:POWER MANAGEMENT IC, PRE-PROG, 3
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:5a9904e59ed0 Category: Brand:

  
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Product Detailed Parameters

  • Description:POWER MANAGEMENT IC, PRE-PROG, 3
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Applications:High Performance i.MX 8, S32x Processor Based
  • Current - Supply:200µA
  • Voltage - Supply:2.5V ~ 5.5V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount, Wettable Flank
  • Package / Case:40-VFQFN Exposed Pad
  • Supplier Device Package:40-HVQFN (6x6)
  • Grade:Automotive
  • Qualification:AEC-Q100

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MPF5023CVNA0ESR2

Overview

The MPF5023CVNA0ESR2 is a power management IC designed for high-performance processor applications. It operates within a supply voltage range of 2.5V to unspecified upper limits and draws a supply current of 200µA. The component is housed in a 40-VFQFN Exposed Pad package, suitable for surface-mount assembly. It is part of the pre-programmed PMIC series intended for integration with specific NXP processor architectures.

Feature Summary

  • Pre-programmed configuration for simplified system integration
  • Optimized for high-performance processor power domains
  • Compact exposed pad package for thermal efficiency

Applications

  • High Performance i.MX 8 Processor Based Systems
  • S32x Processor Based Applications

Procurement Notes

Verify the exact supply voltage upper limit and complete pinout configuration against the official NXP datasheet before finalizing the design. Ensure the 40-VFQFN footprint matches the target PCB layout. Confirm that the pre-programmed settings align with the specific power sequencing requirements of the i.MX 8 or S32x processor variant being utilized.

Selection Notes

Select this component when designing systems based on NXP's high-performance i.MX 8 or S32x processor families. It is appropriate for applications requiring a dedicated, pre-configured power management solution with low quiescent current. Consider the 40-VFQFN package constraints and thermal dissipation needs associated with the exposed pad design during the mechanical layout phase.

Part Context

This device belongs to NXP's portfolio of specialized power management integrated circuits (PMICs). These components are engineered to provide stable and efficient power delivery for complex system-on-chip solutions. The MPF5023 variant specifically targets the power domain requirements of advanced automotive and industrial processing platforms.

Replacement Considerations

Consult the NXP product selection guide for direct replacements within the MPF5023 series or compatible PMICs offering similar voltage rails and package dimensions for i.MX 8 and S32x processors.

MPF5023CVNA0ESR2MPF5023CVNA0ESR2
$2.89
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