MPF5030BMBA0ESR2

MPF5030BMBA0ESR2

$3.29
  • Description:PMIC 3 BUCKS 2 LDO A1 DIE
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:937318f72786 Category: Brand:

  
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Product Detailed Parameters

  • Description:PMIC 3 BUCKS 2 LDO A1 DIE
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Applications:System Basis Chip
  • Current - Supply:-
  • Voltage - Supply:3.3V ~ 5.25V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount, Wettable Flank
  • Package / Case:40-PowerVFQFN
  • Supplier Device Package:40-HVQFN (6x6)
  • Grade:Automotive
  • Qualification:AEC-Q100

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MPF5030BMBA0ESR2

Overview

The MPF5030BMBA0ESR2 is a System Basis Chip (SBC) PMIC designed for S32Z2/E2 processors. It integrates three buck converters and two LDO regulators within a 40-pin HVQFN package. The device operates at supply voltages of 3.3V to 5.25V and supports an extended temperature range from -40°C to 125°C. Classified as Automotive Grade 1 with ASIL D safety level, it provides comprehensive power management solutions for front system supply applications.

Feature Summary

  • Integrates three step-down DC/DC buck converters and two low-dropout linear regulators for efficient multi-rail power distribution.
  • Achieves ASIL D functional safety compliance suitable for critical automotive electronic architectures.
  • Designed specifically for integration with NXP S32Z2/E2 processor families.

Applications

  • NXP S32Z2/E2 processor power systems
  • Automotive front system supply modules
  • ASIL D compliant automotive electronics

Procurement Notes

Verify the specific suffix 'ESR2' corresponds to the tape-and-reel packaging configuration when sourcing. Confirm that the ASIL D grade designation aligns with your functional safety requirements. Ensure the 40-pin HVQFN footprint matches your PCB layout constraints. Cross-reference the manufacturer part number with official NXP documentation to validate authenticity and revision status.

Selection Notes

Select this component when designing for NXP S32Z2 or S32E2 processors requiring integrated power management. Choose this variant over non-ASIL versions if functional safety certification is mandatory. Consider the thermal performance of the HVQFN package relative to your board's heat dissipation capabilities. Verify input voltage compatibility with your system's 3.3V to 5.25V supply rails before finalizing the design.

Part Context

This part belongs to the PF5030 series of specialized power management ICs from NXP Semiconductors. It serves as a System Basis Chip, combining power regulation with interface functions. The series targets advanced automotive applications, offering high integration levels to reduce bill-of-materials complexity while maintaining strict automotive reliability standards.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult NXP official resources for direct replacements or pin-compatible alternatives.

MPF5030BMBA0ESR2MPF5030BMBA0ESR2
$3.29
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