MPF5030BMMA0ESR2

MPF5030BMMA0ESR2

$3.24
  • Description:PMIC 3 BUCKS 2 LDO A1 DIE
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:f8bbbcf90be5 Category: Brand:

  
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Product Detailed Parameters

  • Description:PMIC 3 BUCKS 2 LDO A1 DIE
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Applications:System Basis Chip
  • Current - Supply:-
  • Voltage - Supply:3.3V ~ 5.25V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount, Wettable Flank
  • Package / Case:40-PowerVFQFN
  • Supplier Device Package:40-HVQFN (6x6)
  • Grade:Automotive
  • Qualification:AEC-Q100

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MPF5030BMMA0ESR2

Overview

The MPF5030BMMA0ESR2 is a specialized power management integrated circuit (PMIC) designed for S32Z2/E2 processors. It features three low-voltage integrated synchronous buck converters and two low-dropout regulators (LDOs). The device operates within a supply voltage range of 3.3V to 5.25V, with a typical shutdown current of 15 µA. It is housed in a 40-pin HVQFN package and supports surface mount installation. Certified to AEC-Q100 Grade 1 standards, it functions reliably across an operating temperature range of -40°C to +125°C.

Feature Summary

  • Integrates three synchronous buck converters and two LDOs for comprehensive power regulation
  • Designed specifically for NXP S32Z2/E2 processor families
  • Supports low-power shutdown modes with minimal sleep current consumption
  • Automotive-grade reliability compliant with AEC-Q100 standards

Applications

  • S32Z2/E2 processor system power supply
  • Automotive front-end system applications
  • Power train control units

Procurement Notes

Verify the specific suffix 'ESR2' indicates tape-and-reel packaging when ordering. Confirm the 'MMA0' variant matches the required pinout and electrical characteristics for your design. Ensure compatibility with the target NXP processor family before procurement. Check for RoHS3 compliance status if required by your manufacturing specifications.

Selection Notes

Select this component when designing systems based on NXP S32Z2 or S32E2 processors requiring integrated power management. It is suitable for automotive environments demanding ASIL-D capable system basis chips. Consider its fixed output configurations and limited programmability compared to fully configurable PMICs. Evaluate thermal performance within the 40-pin HVQFN package for your specific PCB layout constraints.

Part Context

This part belongs to the PF5030 series of System Basis Chips from NXP Semiconductors. These devices are engineered to provide robust power management solutions for advanced automotive microcontrollers. The series emphasizes integration, reducing external component count while maintaining high efficiency and reliability for critical vehicle electronics.

Replacement Considerations

Consult official NXP documentation for direct cross-reference alternatives. Verify that any substitute maintains compatibility with the S32Z2/E2 processor interfaces and meets the same AEC-Q100 Grade 1 requirements.

MPF5030BMMA0ESR2MPF5030BMMA0ESR2
$3.24
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