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Product Detailed Parameters
- Description：PMIC 2 BUCKS 2 LDO A1 DIE
- Series：-
- Mfr：NXP USA Inc.
- Package：Tray
- Applications：System Basis Chip
- Current - Supply：-
- Voltage - Supply：3.3V ~ 5.25V
- Operating Temperature：-40°C ~ 125°C (TA)
- Mounting Type：Surface Mount, Wettable Flank
- Package / Case：40-PowerVFQFN
- Supplier Device Package：40-HVQFN (6x6)
- Grade：-
- Qualification：-
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Overview
The MPF5032BMMA5ES is a specialized automotive power management integrated circuit (PMIC) from NXP Semiconductors, designed for S32Z/E processors. It features two buck converters and two low-dropout (LDO) regulators. The device is qualified to AEC-Q100 Grade 1 standards with an operating temperature range of -40°C to +125°C. It utilizes the HLQFP-64 package and supports QM OTP programming configuration.
Feature Summary
- Automotive-grade reliability compliant with AEC-Q100 standards
- Integrated dual buck and dual LDO regulator topology
- Optimized for S32Z/E processor system supply families
Applications
- S32Z2/E2 processor front system supply
- Automotive infotainment systems
- Advanced driver assistance systems (ADAS)
Procurement Notes
Verify the specific die revision and OTP configuration ID against project requirements before ordering. Confirm that the HLQFP-64 package footprint matches the PCB design. Ensure compatibility with the target S32Z/E processor family voltage rails. Check for any specific manufacturing date codes or lot traceability needs required by automotive quality standards.
Selection Notes
Select this component when designing for NXP S32Z/E automotive platforms requiring integrated power regulation. It is suitable for applications needing multiple regulated outputs from a single IC. Consider the thermal performance of the HLQFP-64 package in high-temperature environments. Verify input voltage ranges align with the vehicle's battery architecture.
Part Context
This PMIC belongs to NXP's specialized power management portfolio for automotive microcontrollers. It complements the S32Z and S32E processor families by providing essential voltage rails. The device integrates control logic and power stages to reduce external component count. It supports configurable outputs via OTP programming for flexible system integration.
Replacement Considerations
Consult NXP documentation for direct pin-to-pin replacements within the PF5030 series. Verify functional equivalence for buck and LDO output specifications. Ensure substitute parts meet the same AEC-Q100 Grade 1 qualification and temperature ratings.
