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MPFS025TLS-FCSG325I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC SOC RISC-V 325BGA. Review the specifications below when checking this part for your BOM.
The MPFS025TLS-FCSG325I is a PolarFire SoC FPGA featuring an RV64GC/RV64IMAC RISC-V processor core. It integrates 23,000 logic elements and 1.8 Mbit of embedded memory within a 325-FCBGA package. The device operates at a maximum clock frequency of 667 MHz with L1 cache including 16 kB instruction and 4 x 32 kB data storage. It supports a supply voltage range of 1 V and functions reliably between -40°C and +100°C.
Verify the specific suffix 'TLS' against official Microchip documentation to confirm the exact variant characteristics, as ordering suffixes may indicate distinct packaging or qualification levels. Confirm moisture sensitivity level (MSL 3) and handling requirements prior to assembly. Ensure compliance with export control classifications such as ECCN 5A992C if applicable to your region.
Select this component when a combination of RISC-V processing and FPGA flexibility is required. The 23KLE capacity suits low-density applications. Verify that the 108 available I/O pins meet interface requirements. Consider the 1 V operating voltage for power budget calculations and ensure the PCB design accommodates the fine-pitch FCBGA325 footprint.
This part belongs to the PolarFire SoC family, which combines Microchip's low-power flash-based FPGA fabric with hardened RISC-V processors. It is designed for applications requiring real-time processing capabilities alongside configurable logic, targeting industrial and IoT markets with a focus on security and long-term availability.
Direct substitutes within the same package and pinout include other variants from the MPFS025T series, such as MPFS025TL-FCSG325I or MPFS025TS-FCSG325I, depending on the specific temperature grade and packaging requirements. Cross-family replacements like M2GL or M2S series require significant schematic and firmware redesign due to architectural differences.
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