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MPN7306-C11 is listed in the RF Diode range at ChipApex. The manufacturer field lists MACOM Technology Solutions. Its product description is RF DIODE PIN 60V 500MW DIE. Review the specifications below when checking this part for your BOM.
The MPN7306-C11 is a silicon PIN diode chip manufactured by MACOM Technology Solutions. It belongs to the MPN7306 series of mesa PIN diodes designed for RF applications. Key electrical specifications include a maximum peak reverse voltage of 60V and a maximum power dissipation of 500 mW. The device features a typical junction capacitance of 0.12 pF and a forward resistance of 1.5 Ohms. It operates within a temperature range defined by standard commercial ratings.
Verify current availability status directly with authorized distributors or the manufacturer, as supply conditions may vary. Confirm that the specific suffix C11 matches the required voltage and package specifications for your design. Ensure compliance with RoHS standards and check for any restricted substance declarations relevant to your region before finalizing procurement orders.
Select this component when a 60V peak reverse voltage rating is sufficient for the application. The 0.12 pF capacitance makes it suitable for higher frequency operations compared to general-purpose diodes. Consider the 1.5 Ohm forward resistance for insertion loss requirements in switching paths. Evaluate thermal management needs based on the 500 mW power dissipation limit.
This part is part of the broader MPN7306 family of silicon PIN diode chips from MACOM. Variants such as MPN7306-C12 and MPN7306-0805-2 exist with different voltage or package characteristics. The MPN7306 series generally targets RF and microwave discrete semiconductor applications requiring reliable pin diode performance.
Direct substitutes are not explicitly listed in public documentation. Engineers should evaluate other MACOM PIN diodes like MPN7306-C12 or generic silicon PIN diodes with matching 60V reverse voltage and similar capacitance/resistance profiles. Verify package compatibility and thermal characteristics before substitution.
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