MPP4206-206

RF Diode Overview

The MPP4206-206 is a silicon PIN diode utilizing Microsemi's monolithic MMSM technology, designed for broadband RF applications from UHF through X-band. It features a package style 206 with a minimum breakdown voltage of 200V at 10μA leakage current and a maximum capacitance of 0.15pF at -10V. Typical series resistance values are 5Ω at 0.01mA, 2.5Ω at 1mA, and 500Ω at 20mA. The device supports up to 10W incident RF power handling and operates within a temperature range of -55°C to +150°C.

RF Diode Feature Summary

• Monolithic MMSM integration eliminates wire bonds to tightly control parasitic inductance and capacitance.
• Smooth non-resonant functionality achieved through X-band operation due to controlled package parasitics.
• Gold terminations provided on RoHS compliant devices.

RF Diode Applications

• RF switching circuits
• Attenuator type applications
• Receiver protection

RF Diode Procurement Notes

Verify the manufacturer designation as Microsemi or Microchip Technology, as corporate acquisition history may affect labeling. Confirm the specific package style 206 and gold termination requirements against the official datasheet specifications. Ensure compliance with EU Directive 2002/95/EC for RoHS status when sourcing.

RF Diode Selection Notes

Select this component for high-voltage switching or attenuation needs requiring low parasitics. The 200V breakdown voltage distinguishes it from lower-voltage siblings like the MPP4204. Verify that the typical series resistance characteristics align with the required drive current levels for the specific circuit impedance.

RF Diode Part Context

This part belongs to the MPP4000 series of surface mount PIN diodes manufactured by Microsemi (now Microchip Technology). The series utilizes unique wafer-level package/device integration to achieve performance suitable for microwave frequencies.

RF Diode Replacement Considerations

Other models in the MPP4201–MPP4206 family share the same package style but differ significantly in breakdown voltage and series resistance. Cross-compatibility requires matching the specific electrical parameters rather than assuming interchangeability based on footprint alone.