MR0A08BCMA35R

Memory IC Overview

The MR0A08BCMA35R is a magnetoresistive random access memory (MRAM) device manufactured by Everspin Technologies. It features a storage capacity of 1 Mbit organized as 128K x 8 with an 8-bit data bus width. The component utilizes a parallel interface and offers a typical access time of 35 ns. It operates within a supply voltage range of 3 V to 3.6 V, with working power currents specified at 25 mA and 55 mA. The device is housed in a BGA-48 package and supports surface mount installation. It is rated for an operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

• Non-volatile magnetic storage technology providing instant-on capability without initialization delays.
• Parallel I/O interface supporting high-speed data transfer with standard control signals.
• Robust endurance characteristics suitable for frequent write-intensive applications.

Memory IC Applications

• Industrial automation systems requiring reliable non-volatile data logging
• Automotive electronics needing durable memory for configuration storage
• Consumer devices utilizing persistent settings retention

Memory IC Procurement Notes

Verify the specific suffix 'R' indicates reel packaging when ordering. Confirm RoHS compliance status through official documentation. Ensure compatibility with BGA-48 footprint designs. Check humidity sensitivity handling requirements during assembly. Validate operating temperature ranges against system environmental specifications.

Memory IC Selection Notes

Select this part for applications requiring 1 Mbit parallel MRAM with industrial temperature ratings. Compare access times and power consumption against alternative memory technologies. Consider the BGA-48 package constraints for PCB layout. Evaluate current draw specifications for power budget calculations. Verify interface compatibility with existing microcontroller or processor buses.

Memory IC Part Context

This component belongs to the Everspin MR0A series of parallel MRAM devices. It shares architectural similarities with other parts in the family but differs in organization and package type. The series emphasizes non-volatility and high endurance compared to traditional flash memory solutions.

Memory IC Replacement Considerations

Direct substitutes include MR0A08BCMA35 for tray packaging variants. Cross-reference pinouts and electrical parameters before substitution. Verify thermal performance matches original design requirements.