MR0A08BCSO35

Description：IC RAM 1MBIT PARALLEL 32SOIC
Series：-
Mfr：Everspin Technologies Inc.
Package：Tray

SKU:e6b2c6212f8c Category: Memory IC Brand: Everspin Technologies Inc.

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Product introduction

MR0A08BCSO35 is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 1MBIT PARALLEL 32SOIC. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MR0A08BCSO35

Description：IC RAM 1MBIT PARALLEL 32SOIC
Series：-
Mfr：Everspin Technologies Inc.
Package：Tray
Memory Type：Non-Volatile
Memory Format：RAM
Technology：MRAM (Magnetoresistive RAM)
Memory Size：1Mbit
Memory Organization：128K x 8
Memory Interface：Parallel
Clock Frequency：-
Write Cycle Time - Word, Page：35ns
Voltage - Supply：3V ~ 3.6V
Operating Temperature：-40°C ~ 85°C (TA)
Mounting Type：Surface Mount
Package / Case：32-SOIC (0.295", 7.50mm Width)
Supplier Device Package：32-SOIC
Access Time：35 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for MR0A08BCSO35

MR0A08BCSO35

Memory IC Overview

The MR0A08BCSO35 is a Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It offers a storage capacity of 1 Mbit organized as 128K x 8 bits with an 8-bit data bus width. The device features a parallel interface and a typical access time of 35 ns. It operates within a supply voltage range of 3 V to 3.6 V, with power dissipation rated at 600 mW. The component is housed in a 32-SOIC package and supports surface mount installation. It functions reliably across an industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

Non-volatile memory architecture retaining data without power
Parallel interface supporting high-speed data transfer
Industrial-grade operational temperature stability

Memory IC Applications

Embedded systems requiring persistent data storage
Industrial control units needing rapid write cycles
Automotive electronics operating in harsh environments

Memory IC Procurement Notes

Verify the specific suffix 'SO35' to confirm the 32-SOIC package and 3.3V operation. Confirm lifecycle status as obsolete or active before finalizing design-in decisions. Check for moisture sensitivity levels if reflow soldering is required. Ensure compatibility with existing parallel bus architectures. Validate that the 35 ns access time meets system timing requirements.

Memory IC Selection Notes

Select this part when non-volatility and fast random access are critical. Compare against SRAM for retention needs or Flash for density. Consider the 32-SOIC footprint for PCB layout constraints. Evaluate power consumption against battery-operated limits. Verify voltage tolerance matches the system's 3.3V rail.

Memory IC Part Context

This component belongs to the MR0A08B series of MRAM devices from Everspin Technologies. It shares architectural similarities with other parts in the family but differs in package type and specific electrical characteristics. The SOIC variant provides a through-hole compatible surface mount option compared to BGA alternatives.