MR0A08BCSO35R

Description：IC RAM 1MBIT PARALLEL 32SOIC
Series：-
Mfr：Everspin Technologies Inc.
Package：Tape & Reel (TR)

SKU:2a92fd1cc1a5 Category: Memory IC Brand: Everspin Technologies Inc.

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Product introduction

MR0A08BCSO35R is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 1MBIT PARALLEL 32SOIC. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MR0A08BCSO35R

Description：IC RAM 1MBIT PARALLEL 32SOIC
Series：-
Mfr：Everspin Technologies Inc.
Package：Tape & Reel (TR)
Memory Type：Non-Volatile
Memory Format：RAM
Technology：MRAM (Magnetoresistive RAM)
Memory Size：1Mbit
Memory Organization：128K x 8
Memory Interface：Parallel
Clock Frequency：-
Write Cycle Time - Word, Page：35ns
Voltage - Supply：3V ~ 3.6V
Operating Temperature：-40°C ~ 85°C (TA)
Mounting Type：Surface Mount
Package / Case：32-SOIC (0.295", 7.50mm Width)
Supplier Device Package：32-SOIC
Access Time：35 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for MR0A08BCSO35R

MR0A08BCSO35R

Memory IC Overview

The MR0A08BCSO35R is a 1 Mbit Magnetoresistive Random Access Memory (MRAM) device manufactured by Everspin Technologies. It features a parallel interface with an organization of 128K x 8 and an 8-bit data bus width. The component operates within a supply voltage range of 3 V to 3.6 V, delivering a typical access time of 35 ns. It is housed in a 32-pin SOIC package and supports surface mount installation. The device functions reliably across an industrial temperature range from -40°C to +85°C, with a maximum power dissipation of 600 mW.

Memory IC Feature Summary

Non-volatile memory architecture retaining data without continuous power
Parallel I/O interface supporting standard digital logic connections
Industrial-grade thermal stability for extended operational environments

Memory IC Applications

Embedded systems requiring persistent configuration storage
Industrial control units needing rapid data retention
Automotive electronics demanding high reliability

Memory IC Procurement Notes

Verify the specific suffix code against official manufacturer documentation to confirm package type and temperature grade. Ensure compatibility with existing board layouts regarding the SOIC-32 footprint. Confirm humidity sensitivity handling requirements during assembly processes. Cross-reference electrical specifications with system power constraints before integration.

Memory IC Selection Notes

Select this component when non-volatile storage with fast random access is required. Compare pinout compatibility with legacy SRAM designs if replacing volatile memory. Evaluate power consumption profiles against available supply rails. Consider the industrial temperature range suitability for the intended deployment environment.

Memory IC Part Context

This part belongs to the MR0A08B series of parallel MRAM devices. It shares core architectural similarities with other variants in the family, differing primarily in packaging options and environmental ratings. The series provides a drop-in replacement solution for applications previously utilizing static RAM technologies.