Memory IC MR0A08BCYS35 product image

MR0A08BCYS35

$16.59
  • Description:IC RAM 1MBIT PARALLEL 44TSOP2
  • Series:-
  • Mfr:Everspin Technologies Inc.
  • Package:Tray

SKU:2f526b7279fc Category: Brand:

  
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MR0A08BCYS35 is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 1MBIT PARALLEL 44TSOP2. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MR0A08BCYS35

  • Description:IC RAM 1MBIT PARALLEL 44TSOP2
  • Series:-
  • Mfr:Everspin Technologies Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:RAM
  • Technology:MRAM (Magnetoresistive RAM)
  • Memory Size:1Mbit
  • Memory Organization:128K x 8
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:35ns
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:44-TSOP (0.400", 10.16mm Width)
  • Supplier Device Package:44-TSOP2
  • Access Time:35 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MR0A08BCYS35

MR0A08BCYS35

Memory IC Overview

The MR0A08BCYS35 is a 1 Mbit Magnetoresistive Random Access Memory (MRAM) manufactured by Everspin Technologies. It features a parallel interface with an organization of 128k x 8 and an access time of 35 ns. The device operates within a supply voltage range of 3 V to 3.6 V, consuming 25 mA during active operation and 55 mA in standby mode. It is housed in a BGA-48 package and supports surface mount installation. The component functions reliably across an industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Non-volatile memory technology retaining data without power
  • Parallel I/O interface for direct system integration
  • Industrial-grade thermal stability for harsh environments

Memory IC Applications

  • Industrial control systems requiring persistent storage
  • Automotive electronics operating under variable temperatures
  • Embedded systems needing fast random access capabilities

Memory IC Procurement Notes

Verify the specific suffix designation against official manufacturer documentation to confirm package type and environmental rating. Ensure compatibility with existing board layouts regarding the BGA-48 footprint. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly to prevent component damage during manufacturing processes.

Memory IC Selection Notes

Select this component when non-volatile storage with high endurance and low latency is required. Compare the 128k x 8 organization against alternative densities if larger capacity is needed. Evaluate the parallel interface requirements against serial alternatives for system bus compatibility and pin count constraints.

Memory IC Part Context

This part belongs to the MR0A series of MRAM devices from Everspin Technologies. It shares architectural similarities with other parallel MRAM products but differs in density and packaging. The series is designed for applications demanding high write endurance and radiation tolerance compared to traditional flash memory technologies.

Memory IC Replacement Considerations

Consult official substitution guides for equivalent parts within the same family. Verify pinout compatibility and electrical specifications before replacing existing components in production designs.

MR0A08BCYS35MR0A08BCYS35
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