MR0A08BMA35R

Memory IC Overview

The MR0A08BMA35R is a magnetoresistive random access memory device manufactured by Everspin Technologies. It features a storage capacity of 1 Mbit organized as 128 k x 8 with an 8-bit data bus width. The component utilizes a parallel interface and offers a typical access time of 35 ns. It operates within a supply voltage range of 3 V to 3.6 V, with working power currents specified at 25 mA and 55 mA. The device is housed in a BGA-48 package suitable for surface mount technology. It supports an industrial operating temperature range from 0°C to +70°C and has a maximum power dissipation rating of 600 mW.

Memory IC Feature Summary

• Non-volatile magnetic memory architecture providing instant-on capability without initialization delays
• Parallel I/O interface supporting high-speed data transfer with standard control signals
• Robust endurance characteristics designed for frequent write cycle applications

Memory IC Applications

• Industrial automation systems requiring reliable non-volatile data retention
• Embedded controllers needing fast boot-up times and high write endurance
• Automotive electronics operating within specified temperature ranges

Memory IC Procurement Notes

Verify the specific suffix 'R' indicates reel packaging when ordering. Confirm moisture sensitivity levels and pre-baking requirements if the seal has been compromised. Ensure the BGA-48 footprint matches the target PCB design. Check RoHS compliance documentation for final assembly standards. Validate the 3.3V nominal supply compatibility with the system power rails.

Memory IC Selection Notes

Select this part for applications requiring 1 Mbit capacity with an 8-bit parallel interface. Compare against MR0A08BCMA35 for extended temperature ranges if operation below 0°C is required. Consider MR0A16AMA35R if a 16-bit data bus width is necessary for the same capacity. Verify that the BGA-48 package fits the available board space constraints.

Memory IC Part Context

This component belongs to the MR0A08B series of parallel MRAM devices from Everspin Technologies. It shares architectural similarities with other parts in the family but differs in packaging and temperature specifications. The series is designed to replace traditional SRAM and Flash memory solutions in embedded systems.

Memory IC Replacement Considerations

MR0A08BCMA35 offers the same electrical specifications but supports an extended temperature range down to -40°C. MR0A08BMA35 provides identical performance in a tray package instead of a reel. MR0A08BCYS35R is another reel-packaged variant with potentially different thermal or mechanical characteristics.