Memory IC MR0A08BSO35R product image

MR0A08BSO35R

  • Description:IC RAM 1MBIT PARALLEL 32SOIC
  • Series:-
  • Mfr:Everspin Technologies Inc.
  • Package:Tape & Reel (TR)

SKU:950c5ccdd450 Category: Brand:

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MR0A08BSO35R is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 1MBIT PARALLEL 32SOIC. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MR0A08BSO35R

  • Description:IC RAM 1MBIT PARALLEL 32SOIC
  • Series:-
  • Mfr:Everspin Technologies Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:RAM
  • Technology:MRAM (Magnetoresistive RAM)
  • Memory Size:1Mbit
  • Memory Organization:128K x 8
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:35ns
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:32-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package:32-SOIC
  • Access Time:35 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MR0A08BSO35R

MR0A08BSO35R

Memory IC Overview

The MR0A08BSO35R is a 1 Mbit Magnetoresistive Random Access Memory (MRAM) device manufactured by Everspin Technologies. It features a parallel interface with an organization of 128K x 8 bits and an 8-bit data bus width. The component operates within a supply voltage range of 3 V to 3.6 V, delivering a typical access time of 35 ns. It is housed in a 32-pin Small Outline Integrated Circuit (SOIC) package designed for surface mount technology. The device supports an industrial operating temperature range from -40°C to +85°C and has a maximum power dissipation rating of 600 mW.

Memory IC Feature Summary

  • Non-volatile memory architecture providing instant-on capability without initialization delays
  • Parallel I/O interface supporting standard synchronous read and write operations
  • High endurance characteristics suitable for frequent write-intensive applications

Memory IC Applications

  • Industrial control systems requiring reliable non-volatile data storage
  • Automotive electronics operating in high-temperature environments
  • Embedded systems needing fast boot-up times and high write endurance

Memory IC Procurement Notes

Verify the specific suffix 'B' indicates the correct temperature grade and package variant. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly. Check for active manufacturing status as some variants may be discontinued. Ensure compatibility with existing PCB footprints for the 32-SOIC package. Validate supply chain authenticity through authorized distributors.

Memory IC Selection Notes

Select this part when a 1 Mbit capacity with parallel interface is required. Choose this model over serial options if higher throughput and simpler controller logic are needed. Consider the 32-SOIC package for through-hole or standard surface mount constraints. Evaluate power consumption requirements against the specified 600 mW dissipation limit. Compare access speeds with other MRAM families if sub-35 ns performance is critical.

Memory IC Part Context

This component belongs to the MR0A08B series of parallel MRAM devices from Everspin Technologies. It shares architectural similarities with other members like the MR0A08BCMA35R but differs in packaging and thermal specifications. The series is designed to replace traditional SRAM and Flash in applications demanding non-volatility and high speed.

Memory IC Replacement Considerations

Public confirmed substitute part numbers: MR0A08BCSO35R.

MR0A08BSO35RMR0A08BSO35R

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