MR10Q010VSCR

Memory IC Overview

The MR10Q010VSCR is a 1 Mbit Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a storage organization of 128K x 8 bits and utilizes a Quad SPI serial interface with a data bus width of 8 bits. The device operates within a supply voltage range of 3 V to 3.6 V, drawing working power currents of 60 mA or 100 mA depending on the operational mode. It offers a fast access time of 7 ns and supports surface mount installation in an SOIC-16 package. The component is rated for extended industrial operating temperatures from -40°C to +105°C and includes humidity sensitivity classification.

Memory IC Feature Summary

• Non-volatile memory technology providing instant-on capability without initialization delays.
• Quad SPI interface supporting high-speed serial communication protocols.
• Extended temperature range suitability for demanding industrial environments.

Memory IC Applications

• Industrial control systems requiring reliable non-volatile data retention
• Automotive electronics operating under extreme thermal conditions
• Embedded systems needing rapid boot-up times

Memory IC Procurement Notes

Verify the specific suffix 'R' indicates reel packaging configuration when sourcing. Confirm moisture sensitivity level requirements align with assembly line handling procedures. Ensure the SOIC-16 footprint matches the target PCB design constraints. Cross-reference the exact voltage and current specifications against the system power budget before finalizing procurement decisions.

Memory IC Selection Notes

Select this part for applications requiring non-volatile storage with SRAM-like speed and low power consumption. The SOIC-16 package is suitable for standard surface mount processes. Consider the -40°C to +105°C rating for harsh environment deployments. Verify compatibility with existing Quad SPI controllers on the host microcontroller.

Memory IC Part Context

This component belongs to the MR10Q010 series of MRAM devices from Everspin Technologies. The series offers various packaging options including BGA and SOIC formats with different temperature grades. The VSCR variant specifically denotes the commercial/industrial temperature grade housed in a small outline integrated circuit package.

Memory IC Replacement Considerations

Direct substitutes include other MR10Q010 variants such as MR10Q010VSC for tray packaging or MR10Q010MB for BGA packaging, provided the temperature and interface requirements remain consistent.