MR1A16AYS35

Memory IC Overview

The MR1A16AYS35 is a magnetoresistive random access memory (MRAM) device manufactured by Everspin Technologies. It features a storage capacity of 2 Mbit organized as 128 k x 16 bits with a 16-bit data bus width. The component utilizes a parallel interface and offers an access time of 35 ns. It operates within a voltage range of 3 V to 3.6 V, consuming 55 mA or 105 mA depending on the operational mode. The device is housed in a TSOP-II-44 package suitable for surface mount technology and supports an industrial operating temperature range from 0°C to +70°C.

Memory IC Feature Summary

• Nonvolatile memory architecture that retains data without power
• Parallel I/O interface supporting high-speed data transfer
• Industrial-grade thermal stability for reliable operation

Memory IC Applications

• Industrial control systems requiring persistent data storage
• Automotive electronics applications
• Smart devices needing durable memory solutions

Memory IC Procurement Notes

Verify the specific suffix 'S' against official datasheets to confirm the commercial temperature grade (0°C to +70°C). Ensure the ordering quantity aligns with manufacturer reel specifications. Confirm RoHS compliance status through current documentation before finalizing procurement decisions.

Memory IC Selection Notes

Select this component when a 2 Mbit nonvolatile memory solution with parallel interface is required. Consider the 35 ns access speed and 3.3 V supply requirements. Verify that the TSOP-II-44 package fits the design constraints and that the commercial temperature range meets the application environment.

Memory IC Part Context

This part belongs to the MR1A16A series of parallel MRAM devices. These components are designed to replace traditional SRAM and Flash technologies by offering unlimited endurance and fast write speeds. The series provides a robust solution for embedded systems requiring high reliability and data retention capabilities.

Memory IC Replacement Considerations

Compare electrical parameters such as access time, voltage range, and pinout compatibility with alternative MRAM parts. Verify package dimensions and thermal characteristics to ensure mechanical fit. Consult official substitution lists for confirmed equivalents.