MR256A08BCMA35

Memory IC Overview

The MR256A08BCMA35 is a magnetoresistive random access memory (MRAM) integrated circuit manufactured by Everspin Technologies Inc. It features a storage capacity of 256 kilobits organized as 32K words by 8 bits. The device utilizes a parallel interface with an access time and write cycle time of 35 nanoseconds. It operates within a supply voltage range of 3V to 3.6V and supports surface mount installation in a BGA-48 package. The component is designed for industrial temperature ranges, functioning between -40°C and +85°C.

Memory IC Feature Summary

• Non-volatile data retention utilizing spin-transfer torque MRAM technology
• Parallel I/O interface supporting high-speed data transfer
• Industrial-grade operational temperature range capability

Memory IC Applications

• Data logging systems requiring non-volatile storage
• Industrial control applications needing fast write cycles
• Embedded systems requiring high endurance memory

Memory IC Procurement Notes

Verify the specific package variant and temperature grade against the original design requirements before procurement. Confirm that the BGA-48 footprint matches the target PCB layout. Ensure the supply voltage specifications align with the system power rails. Check for any recent product change notices regarding material composition or manufacturing location updates.

Memory IC Selection Notes

Select this component when a parallel interface is required for the memory subsystem. Consider the BGA-48 package constraints during the mechanical design phase. Evaluate the thermal management capabilities of the enclosure to maintain operation within the specified industrial temperature limits. Compare performance metrics against serial alternatives if board space is limited.

Memory IC Part Context

This part belongs to the MR256A08B series of magnetoresistive random access memories from Everspin Technologies. The series offers non-volatile storage solutions combining the speed of SRAM with the persistence of flash memory. These devices are engineered for applications demanding high write endurance and low power consumption in compact form factors.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers include MR256A08BSO35R.