Memory IC MR256A08BCYS35 product image

MR256A08BCYS35

$8.67
  • Description:IC RAM 256KBIT PARALLEL 44TSOP2
  • Series:-
  • Mfr:Everspin Technologies Inc.
  • Package:Tray

SKU:fec300b7ed86 Category: Brand:

  
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MR256A08BCYS35 is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 256KBIT PARALLEL 44TSOP2. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MR256A08BCYS35

  • Description:IC RAM 256KBIT PARALLEL 44TSOP2
  • Series:-
  • Mfr:Everspin Technologies Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:RAM
  • Technology:MRAM (Magnetoresistive RAM)
  • Memory Size:256Kbit
  • Memory Organization:32K x 8
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:35ns
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:44-TSOP (0.400", 10.16mm Width)
  • Supplier Device Package:44-TSOP2
  • Access Time:35 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MR256A08BCYS35

MR256A08BCYS35

Memory IC Overview

The MR256A08BCYS35 is a magnetoresistive random access memory device manufactured by Everspin Technologies. It features a storage capacity of 256 kbit organized as 32k x 8 with an 8-bit data bus width. The component utilizes a parallel interface and offers a typical access time of 35 ns. It operates within a supply voltage range of 3 V to 3.6 V, consuming 25 mA during read operations and 55 mA during write operations. The maximum power dissipation is rated at 600 mW. The device is housed in a TSOP-II-44 package designed for surface mount installation.

Memory IC Feature Summary

  • Non-volatile data retention capability inherent to magnetoresistive random access memory technology
  • Parallel input/output interface supporting standard synchronous memory protocols
  • Industrial temperature range operation suitable for demanding environmental conditions

Memory IC Applications

  • Embedded systems requiring persistent storage without battery backup
  • Industrial control units needing high endurance memory
  • Automotive electronics operating in harsh thermal environments

Memory IC Procurement Notes

Verify the specific suffix YS35 against official manufacturer documentation to confirm package type and temperature grade. Ensure compatibility with system voltage levels between 3 V and 3.6 V. Confirm humidity sensitivity handling requirements are met during assembly. Cross-reference the exact part number with current datasheets to validate pinout and electrical specifications before integration.

Memory IC Selection Notes

Select this component when non-volatility and high cycle endurance are required over traditional flash memory. The parallel interface suits applications needing direct address/data bus connectivity. Consider the 35 ns access speed for timing constraints. Evaluate the TSOP-II-44 footprint against available board space. Compare power consumption metrics against system budget requirements.

Memory IC Part Context

This part belongs to the MR256A08B series of parallel MRAM devices from Everspin Technologies. It shares architectural similarities with other members like MR256A08BMA35 but differs in packaging and commercial/industrial grading. The series provides a robust alternative to EEPROM and Flash technologies in embedded memory applications.

Memory IC Replacement Considerations

Direct substitutes include MR256A08BMA35 if package differences are acceptable. Verify functional equivalence with MR0A08BCYS35R only if capacity adjustments are permissible. Consult official replacement guides for pin-compatible alternatives within the same product family.

MR256A08BCYS35MR256A08BCYS35
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