Memory IC MR256A08BSO35 product image

MR256A08BSO35

  • Description:IC RAM 256KBIT PARALLEL 32SOIC
  • Series:-
  • Mfr:Everspin Technologies Inc.
  • Package:Tray

SKU:7871cea4ae3f Category: Brand:

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MR256A08BSO35 is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 256KBIT PARALLEL 32SOIC. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MR256A08BSO35

  • Description:IC RAM 256KBIT PARALLEL 32SOIC
  • Series:-
  • Mfr:Everspin Technologies Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:RAM
  • Technology:MRAM (Magnetoresistive RAM)
  • Memory Size:256Kbit
  • Memory Organization:32K x 8
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:35ns
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:32-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package:32-SOIC
  • Access Time:35 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MR256A08BSO35

MR256A08BSO35

Memory IC Overview

The MR256A08BSO35 is a magnetoresistive random access memory (MRAM) device manufactured by Everspin Technologies. It offers a storage capacity of 256 Kbit, organized as 32K x 8 bits with an 8-bit data bus width. The component features a parallel interface and a typical access time of 35 ns. It operates within a supply voltage range of 3 V to 3.6 V and supports surface mount installation in a 32-SOIC package. The device is rated for commercial operating temperatures between 0°C and +70°C.

Memory IC Feature Summary

  • Non-volatile magnetic storage technology providing instant-on capability without initialization delays.
  • Parallel I/O interface supporting standard synchronous read and write operations.
  • High endurance characteristics suitable for applications requiring frequent data updates.

Memory IC Applications

  • Industrial control systems requiring reliable non-volatile data logging
  • Automotive electronics needing robust memory under varying thermal conditions
  • Consumer devices utilizing persistent configuration storage

Memory IC Procurement Notes

Verify the specific suffix designation against official manufacturer documentation to confirm package type and temperature grade accuracy. Ensure compatibility with system voltage levels and interface timing requirements before integration. Confirm current production status and lifecycle stage through authorized distribution channels to mitigate obsolescence risks during long-term deployment.

Memory IC Selection Notes

Select this component when a parallel interface is required for high-speed data access in space-constrained designs. The 32-SOIC package offers a compact footprint suitable for surface-mount assembly processes. Consider the 35 ns access time and 3V-3.6V operating range to ensure alignment with system power and performance specifications.

Memory IC Part Context

This part belongs to the MR256A08B series of parallel MRAM devices from Everspin Technologies. The series utilizes spin-transfer torque magnetic tunnel junction technology to provide non-volatile memory solutions. These devices are designed to replace traditional volatile RAM and EEPROM combinations in embedded systems.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers include MR256A08BMA35R and MR256A08BCSO35R. Verify pinout compatibility and electrical specifications before substitution.

MR256A08BSO35MR256A08BSO35

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