MR256A08BSO35R

Memory IC Overview

The MR256A08BSO35R is a non-volatile magnetic random access memory (MRAM) integrated circuit manufactured by Everspin Technologies. It provides a storage capacity of 256 kilobits, organized as 32K words by 8 bits. The device utilizes a parallel interface with an 8-bit data bus width and features a typical access time of 35 nanoseconds. It operates within a supply voltage range of 3 volts to 3.6 volts. The component is housed in a 32-pin small outline integrated circuit (SOIC) package with a width of 7.50 millimeters.

Memory IC Feature Summary

• Non-volatile data retention capability inherent to magnetoresistive technology
• Parallel input/output interface supporting standard logic levels
• Surface-mount installation suitable for automated assembly processes

Memory IC Applications

• Industrial control systems requiring persistent data storage
• Embedded applications needing fast random access memory replacement
• Automotive electronics operating within specified temperature ranges

Memory IC Procurement Notes

Verify the specific suffix designation against the manufacturer's current documentation to confirm pinout compatibility and electrical specifications. Confirm availability status as distribution channels may list obsolete or end-of-life inventory. Ensure the procurement source provides valid traceability and authenticity guarantees for electronic components.

Memory IC Selection Notes

Select this component when a parallel interface is required for direct microcontroller connection without serial protocol overhead. Consider the 32-SOIC package dimensions for printed circuit board layout constraints. Evaluate the 35-nanosecond access speed against system timing requirements to ensure adequate performance margins.

Memory IC Part Context

This part belongs to the MR256A08B series of magnetoresistive random access memories from Everspin Technologies. The series offers non-volatile storage solutions that combine the speed of static RAM with the persistence of flash memory. The SOIC package variant provides a through-hole compatible footprint alternative to surface-mount options.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers include MR256A08BMA35R. Verify mechanical footprint and electrical parameter alignment before implementation.