MR25H10CDF

Memory IC Overview

The MR25H10CDF is a 1 Mbit Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a storage organization of 128 k x 8 bits and utilizes a Serial Peripheral Interface (SPI) for data communication. The device operates within a supply voltage range of 2.7 V to 3.6 V, with typical operating currents specified at 6 mA and 23 mA under different modes. It is housed in an 8-lead DFN package designed for surface mount technology. The component supports an industrial temperature range from -40°C to +85°C and has a maximum power dissipation rating of 600 mW.

Memory IC Feature Summary

• Non-volatile magnetic memory technology providing unlimited write endurance and high data retention without write delays.
• Integrated SPI interface supporting clock rates up to 40 MHz for fast and simple serial data transfer.
• Automatic data protection mechanisms that preserve stored information during unexpected power loss events.
• Configurable block write protection capabilities to secure specific memory regions against unauthorized modifications.

Memory IC Applications

• Industrial control systems requiring reliable non-volatile data logging
• Automotive electronics applications demanding high endurance and wide temperature stability
• Embedded systems replacing legacy serial EEPROM or Flash memory solutions

Memory IC Procurement Notes

Verify the specific suffix 'CDF' corresponds to the tray packaging configuration rather than reel or cut tape options when sourcing. Confirm the manufacturer's current design status, as some variants may carry notices regarding new design recommendations. Ensure compliance with moisture sensitivity levels and reflow soldering profiles appropriate for the 8-pin DFN package type.

Memory IC Selection Notes

Select this component when designing systems that require infinite write cycles and robust data retention over extended periods. It serves as a direct functional replacement for serial EEPROM and Flash technologies where wear leveling is not feasible. Consider the 8-pin DFN footprint constraints and verify that the SPI interface timing meets the system's clock frequency requirements.

Memory IC Part Context

This part belongs to the MR25H10 series of serial MRAM devices from Everspin Technologies. The series offers various capacity and package options, including MR25H10MDC and MR25H10CDFR. The CDF variant specifically denotes the standard 8-pin DFN package with a larger exposed pad, distinct from smaller flag packages or alternative packaging formats like reels.

Memory IC Replacement Considerations

Direct substitutes include other MR25H10 series variants such as MR25H10MDC or MR25H10CDFR, provided the packaging difference does not impact assembly processes. Verify pin compatibility and electrical specifications before swapping between different package suffixes within the same family.