MR25H128AMDF

Memory IC Overview

The MR25H128AMDF is a magnetoresistive random-access memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a storage capacity of 128 kbit organized as 16k x 8 with an 8-bit data bus width. The device utilizes a Serial Peripheral Interface (SPI) for communication and operates within a supply voltage range of 2.7 V to 3.6 V. It is housed in an 8-lead DFN package and supports operating temperatures from -40°C to +125°C.

Memory IC Feature Summary

• Non-volatile magnetic storage technology providing unlimited endurance without wear-out mechanisms.
• Serial SPI interface enabling simple connection to microcontrollers and processors.
• Wide industrial temperature range suitable for harsh environmental conditions.

Memory IC Applications

• Data logging in automotive systems
• Configuration storage in industrial controllers
• Event recording in consumer electronics

Memory IC Procurement Notes

Verify the specific suffix 'MDF' corresponds to the required 8-DFN package variant during sourcing. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure design-in compatibility with the specified 2.7V to 3.6V supply rails and SPI timing requirements.

Memory IC Selection Notes

Select this component when non-volatile memory with high endurance and fast write speeds is required. Compare against EEPROM or Flash alternatives where limited write cycles are a constraint. Verify that the 128 kbit capacity meets system storage needs and that the SPI interface aligns with available controller resources.

Memory IC Part Context

This part belongs to the MR25H128A series of MRAM devices. It shares architectural similarities with other members like the MR25H256AMDF but offers lower density. The series is designed for applications requiring frequent data updates and long-term reliability without the complexity of charge-based memory technologies.

Memory IC Replacement Considerations

Direct substitutes within the same family include variants with different packaging or temperature grades, such as the MR25H128MDC if leaded options are needed. Cross-technology replacements like EEPROMs require careful evaluation of endurance and speed differences.