MR25H256ACDF

Memory IC Overview

The MR25H256ACDF is a non-volatile magnetic random access memory (MRAM) integrated circuit manufactured by Everspin Technologies. It provides a storage capacity of 256 kilobits, organized as 32K words by 8 bits. The device utilizes a Serial Peripheral Interface (SPI) for data communication and operates within a supply voltage range of 2.7 V to 3.6 V. It is housed in an 8-lead DFN package with exposed pad. The component supports industrial operating temperatures from -40°C to +85°C.

Memory IC Feature Summary

• Non-volatile data retention without requiring backup power sources
• High-speed serial SPI interface for efficient data transfer
• Robust construction suitable for demanding industrial environments

Memory IC Applications

• Industrial data logging systems
• Parameter storage in embedded controllers
• Configuration memory for sensor networks

Memory IC Procurement Notes

Verify the specific suffix 'ACDF' corresponds to the tape-and-reel or tray packaging variant required for your assembly line. Confirm that the 8-DFN footprint matches your PCB layout constraints. Ensure the 2.7V to 3.6V supply rail aligns with your system's power management design before finalizing procurement orders.

Memory IC Selection Notes

Select this part when non-volatility and high endurance are critical compared to flash memory. The SPI interface simplifies board routing compared to parallel alternatives. Consider the 32Kx8 organization size relative to your application's data requirements. Verify thermal performance within the specified -40°C to +85°C range for your specific enclosure conditions.

Memory IC Part Context

This component belongs to the MR25H256 series of serial MRAM devices. It shares architectural similarities with other members like the MR25H256ACDFR, differing primarily in packaging format. The series represents Everspin's solution for replacing traditional EEPROM and Flash in applications requiring frequent write cycles.

Memory IC Replacement Considerations

The MR25H256ACDFR is a direct functional substitute offering identical electrical specifications but packaged in cut-tape or reel formats for automated surface-mount assembly.