MR25H256CDC

Memory IC Overview

The MR25H256CDC is a 256 kbit Magnetoresistive Random Access Memory (MRAM) device manufactured by Everspin Technologies. It features a 32K x 8 organization with an 8-bit data bus width and utilizes a Serial Peripheral Interface (SPI). The component operates within a supply voltage range of 2.7 V to 3.6 V, with working power currents specified at 6 mA and 23 mA. It is housed in an 8-DFN package with dimensions of 5x6 mm and supports surface mount installation. The device functions reliably across a temperature range of -40°C to +85°C, with a maximum power dissipation of 600 mW.

Memory IC Feature Summary

• Non-volatile magnetic storage technology providing instant-on capability without initialization delays.
• Serial SPI interface compatibility for simplified system integration and reduced pin count.
• High endurance characteristics suitable for frequent write operations compared to traditional flash memory.

Memory IC Applications

• Data logging systems requiring persistent storage of operational parameters.
• Parameter storage for efficient operation of electric powertrains.
• Industrial control units needing reliable non-volatile memory under varying temperatures.

Memory IC Procurement Notes

Verify the specific suffix 'CDC' against the manufacturer's current datasheet to confirm package type and operating temperature range. Confirm whether the NRND status impacts long-term availability or if alternative packages are recommended for new designs. Ensure compliance with RoHS directives and moisture sensitivity levels before procurement.

Memory IC Selection Notes

Select this component when a small capacity non-volatile memory with high write endurance is required. It is appropriate for applications where fast access times and low power consumption are critical. Consider the 8-DFN package constraints and SPI interface requirements during PCB layout design.

Memory IC Part Context

This part belongs to the MR25H256 series of serial MRAM devices from Everspin Technologies. It shares architectural similarities with other variants like the MR25H256AMDF but differs in packaging and temperature specifications. The series is designed for embedded memory applications requiring robustness and speed.

Memory IC Replacement Considerations

Public confirmed substitute part numbers: MR25H256CDCR