Memory IC MR25H256CDF product image

MR25H256CDF

$5.65
  • Description:IC RAM 256KBIT SPI 40MHZ 8DFN
  • Series:-
  • Mfr:Everspin Technologies Inc.
  • Package:Tray

SKU:c95abdb7d841 Category: Brand:

  
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MR25H256CDF is listed in the Memory IC range at ChipApex. The manufacturer field lists Everspin Technologies Inc.. Its product description is IC RAM 256KBIT SPI 40MHZ 8DFN. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MR25H256CDF

  • Description:IC RAM 256KBIT SPI 40MHZ 8DFN
  • Series:-
  • Mfr:Everspin Technologies Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:RAM
  • Technology:MRAM (Magnetoresistive RAM)
  • Memory Size:256Kbit
  • Memory Organization:32K x 8
  • Memory Interface:SPI
  • Clock Frequency:40 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-VDFN Exposed Pad
  • Supplier Device Package:8-DFN (5x6)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MR25H256CDF

MR25H256CDF

Memory IC Overview

The MR25H256CDF is a non-volatile magnetic random-access memory (MRAM) integrated circuit manufactured by Everspin Technologies. It provides a storage capacity of 256 kbit, organized as 32k x 8 bits. The device utilizes a Serial Peripheral Interface (SPI) for communication and operates within a supply voltage range of 2.7 V to 3.6 V. It is housed in an 8-DFN package with dimensions of 5x6 mm. The component supports industrial operating temperatures from -40°C to +85°C and features a maximum clock frequency of 40 MHz.

Memory IC Feature Summary

  • Non-volatile data retention without requiring backup power sources
  • High-speed serial communication via standard SPI interface
  • Robust construction resistant to radiation and magnetic interference

Memory IC Applications

  • Industrial control systems requiring reliable parameter storage
  • Automotive electronics meeting AEC-Q100 Grade 1 specifications
  • Data logging modules in electric vehicle powertrains

Memory IC Procurement Notes

Verify the specific suffix 'CDF' against the manufacturer's current datasheet to confirm the exact temperature grade and packaging configuration. Ensure compatibility with the target system's SPI protocol settings and voltage levels before integration. Check for any recent product change notices regarding lead times or material composition updates.

Memory IC Selection Notes

Select this component when non-volatility and high endurance are critical compared to flash memory alternatives. Consider the 8-DFN footprint constraints and the requirement for a 2.7V to 3.6V supply rail. Evaluate the need for automotive-grade qualification if deploying in harsh environments, noting that other variants in the series may offer extended temperature ranges.

Memory IC Part Context

This part belongs to the MR25H256 family of serial MRAM devices from Everspin Technologies. The family shares common architectural features including magnetoresistive tunnel junction technology. Variants within the series differ primarily in temperature ratings, such as commercial versus industrial grades, and packaging options like tape-and-reel versus trays.

Memory IC Replacement Considerations

Direct substitutes include MR25H256CDC and MR25H256AMDF. Verify pinout compatibility and electrical specifications, particularly operating temperature ranges and voltage tolerances, before swapping components.

MR25H256CDFMR25H256CDF
$5.65
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