MR25H256MDC

Memory IC Overview

The MR25H256MDC is a 256Kb Magnetoresistive Random Access Memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features a 32K x 8 organization with an 8-bit data bus width and utilizes a Serial Peripheral Interface (SPI). The device operates within a supply voltage range of 2.7V to 3.6V, with typical operating currents of 6mA and 23mA. It supports clock frequencies up to 40MHz and functions across an extended temperature range from -40°C to +125°C. The component is housed in an 8-DFN package with dimensions of 5x6mm and includes an exposed pad for thermal management.

Memory IC Feature Summary

• Non-volatile memory technology providing instant-on capability without initialization delays
• High endurance suitable for applications requiring frequent write cycles
• Serial SPI interface for simplified system integration and reduced pin count

Memory IC Applications

• Industrial control systems requiring robust data retention
• Automotive electronics meeting AEC-Q100 standards
• Embedded systems needing high-cycle write endurance

Memory IC Procurement Notes

Verify the specific suffix designation against official documentation, as variations may indicate differences in packaging or temperature ratings. Confirm current lifecycle status, as this part may be marked as Not Recommended for New Designs. Ensure compatibility with existing board layouts regarding the 8-DFN footprint and exposed pad requirements during procurement planning.

Memory IC Selection Notes

Select this component when non-volatile storage with high write endurance is required in space-constrained designs. The 8-DFN package offers a compact solution for surface-mount applications. Consider the extended temperature range if the environment exceeds standard commercial limits. Verify that the SPI interface speed meets the system's timing requirements before finalizing the design.

Memory IC Part Context

This component belongs to the MR25H256 series of serial MRAM devices from Everspin Technologies. It shares architectural similarities with other variants in the family, such as the MR25H256MDCR and MR25H256CDCR, differing primarily in packaging format and operational temperature specifications. The series is designed to replace traditional EEPROMs and Flash memory in applications demanding higher reliability and faster write speeds.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers include MR25H256ACDF and MR25H256MDCR. Verify pinout compatibility and electrical characteristics before substitution.