MR2A16ACYS35

Memory IC Overview

The MR2A16ACYS35 is a 4Mb (256K x 16) parallel interface Magnetoresistive Random Access Memory (MRAM) manufactured by Everspin Technologies. It operates within a supply voltage range of 3V to 3.6V and features a fast access time of 35ns. The device is housed in a 44-pin TSOP-II surface-mount package and supports SMD/SMT installation. It is designed for industrial temperature ranges, typically spanning from -40°C to +85°C, ensuring reliable performance in demanding environments.

Memory IC Feature Summary

• Provides unlimited read and write endurance, eliminating wear-out limitations associated with traditional flash memory technologies.
• Retains data non-volatilely for over 20 years without requiring power or battery backup circuitry.
• Offers SRAM-compatible timing characteristics, allowing integration into existing systems without controller redesign.

Memory IC Applications

• Industrial control systems requiring high reliability and frequent data logging
• Automotive electronics applications meeting AEC-Q100 Grade 1 standards
• Smart devices needing persistent storage for configuration parameters

Memory IC Procurement Notes

Verify the specific suffix 'R' indicates reel packaging when ordering. Confirm the exact temperature grade matches project requirements, as industrial variants differ from commercial options. Ensure compatibility with 3.3V logic levels and parallel interface constraints during system design validation.

Memory IC Selection Notes

Select this component when replacing battery-backed SRAM or flash memory to simplify board design. Consider the 44-pin TSOP-II footprint for space-constrained PCB layouts. Evaluate the 35ns access speed against processor bus requirements to ensure adequate throughput for real-time data caching operations.

Memory IC Part Context

This part belongs to the MR2A16A series of asynchronous MRAM chips. It serves as a direct replacement for volatile SRAM and non-volatile EEPROM/Flash combinations. The technology leverages magnetic tunnel junctions to provide high-speed, durable storage solutions for embedded applications.

Memory IC Replacement Considerations

Check pinout compatibility with legacy SRAM designs. Verify that the target system can support the parallel I/O width of 16 bits. Ensure thermal management aligns with the specified industrial operating temperature range.