MR3A16ACYS35R

Memory IC Overview

The MR3A16ACYS35R is a magnetic random-access memory (MRAM) integrated circuit manufactured by Everspin Technologies. It features an 8 Mbit storage capacity organized as 512 k x 16 bits with a 16-bit data bus width. The device utilizes a parallel interface and offers a 35 ns access time. It operates within a supply voltage range of 3 V to 3.6 V, with working power currents specified at 60 mA and 152 mA. The component is housed in a TSOP-II-54 package designed for surface-mount installation. It supports an operating temperature range from -40°C to +85°C and has a maximum power dissipation of 600 mW.

Memory IC Feature Summary

• Non-volatile magnetic storage technology providing unlimited read/write endurance without requiring charge pumping or high-voltage generation circuits.

Memory IC Applications

• Industrial control systems requiring persistent data retention under harsh environmental conditions
• Automotive electronics applications demanding high reliability and extended temperature operation
• Embedded systems needing fast boot times and immediate data availability upon power-up

Memory IC Procurement Notes

Verify the specific suffix 'R' indicates reel packaging when ordering. Confirm that the required quantity aligns with the manufacturer's standard reel pack size. Ensure the design accommodates the TSOP-II-54 footprint and thermal requirements for 600 mW dissipation. Check for RoHS compliance documentation relevant to the target market regulations before finalizing procurement.

Memory IC Selection Notes

Select this part when a parallel interface is required for direct CPU connection without external controllers. Choose the 8 Mbit density if larger capacities like the MR4 series are unnecessary. Consider the industrial temperature grade (-40°C to +85°C) for environments exceeding commercial limits. Verify that the 3.3V nominal supply voltage matches the system power rails.

Memory IC Part Context

This component belongs to the MR3A16A family of parallel MRAM devices from Everspin Technologies. It shares architectural similarities with other members of the series but differs in specific packaging and organizational parameters. The MR3A16ACYS35R specifically denotes the 8 Mbit variant in a TSOP-II package, distinguishing it from higher-density BGA options.

Memory IC Replacement Considerations

Direct pin-to-pin replacements within the same family include MR3A16ACYS35. For different packaging, verify electrical compatibility with MR3A16ACMA35. Cross-referencing with MR4 series parts requires careful attention to density and interface differences.