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MS22 12103-A is listed in the Inrush Current Limiters (ICL) range at ChipApex. The manufacturer field lists Vishay Ametherm. Its product description is ICL 120 OHM 25% 3A 23MM. Review the specifications below when checking this part for your BOM.
The MS2212103-A is a negative temperature coefficient (NTC) thermistor belonging to the MegaSurge MS22 series, manufactured by Vishay Ametherm. Designed as an inrush current limiter (ICL), this component features a disc diameter of 22 mm and a nominal resistance of 120 Ohms at 25°C with a tolerance of ±25%. It supports a steady-state current rating of 3 A and utilizes radial leads for through-hole mounting. The device is engineered to absorb high energy inputs ranging from 75 to 900 joules, providing robust protection against surge currents in electronic circuits.
Verify the specific suffix designation when ordering, as variations may exist within the product line. Confirm that the required steady-state current and energy absorption ratings align with the circuit design specifications. Ensure compatibility with through-hole mounting processes and verify lead spacing requirements against the PCB layout constraints prior to procurement.
Select this component based on its 120 Ohm resistance value and 3 A current handling capacity. Consider the 22 mm physical size for adequate heat dissipation and mechanical stability. Evaluate the application's peak inrush energy requirements to ensure they fall within the specified 75 to 900 joule range for optimal performance and longevity.
This part belongs to the MegaSurge MS22 series of inrush current limiters. The series is characterized by large disc sizes and high energy ratings, distinguishing it from smaller, lower-power NTC thermistors. It serves as a critical protective element in power supply inputs and transformer primary circuits where high initial charging currents are prevalent.
Direct substitutes must match the 120 Ohm resistance, 3 A rating, and 22 mm form factor. Cross-reference with other manufacturers' ICLs offering similar energy absorption capabilities. Verify that any alternative component maintains the same thermal characteristics and mounting dimensions to ensure seamless integration without redesigning the PCB footprint.
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