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Product Detailed Parameters
- Description：DIODE MOD SIC 1700V 50A SOT227
- Series：-
- Mfr：Microchip Technology
- Package：Tube
- Diode Configuration：2 Independent
- Technology：SiC (Silicon Carbide) Schottky
- Voltage - DC Reverse (Vr) (Max)：1700 V
- Current - Average Rectified (Io) (per Diode)：50A
- Voltage - Forward (Vf) (Max) @ If：1.8 V @ 50 A
- Speed：No Recovery Time > 500mA (Io)
- Reverse Recovery Time (trr)：0 ns
- Current - Reverse Leakage @ Vr：200 µA @ 1700 V
- Operating Temperature - Junction：-55°C ~ 175°C
- Mounting Type：Chassis Mount
- Package / Case：SOT-227-4, miniBLOC
- Supplier Device Package：SOT-227 (ISOTOP®)
- Grade：-
- Qualification：-
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Overview
The MSC2X50SDA170J is a Silicon Carbide Schottky diode module manufactured by Microchip Technology. It features a dual anti-parallel configuration housed in an SOT-227 package with screw mount installation. The device supports a maximum reverse voltage of 1700 V and a forward current of 50 A per leg. Typical forward voltage is 1.5 V, with typical reverse leakage current at 50 µA. Total capacitive charge is specified at 410 nC. Operating temperature ranges from -55°C to +175°C.
Feature Summary
- Utilizes Silicon Carbide (SiC) technology for high-efficiency power conversion
- Dual anti-parallel configuration enables compact circuit design
- SOT-227 package provides robust mechanical stability via screw mounting
Applications
- High-voltage industrial power supplies
- Motor drive inverters
- Uninterruptible power systems (UPS)
Procurement Notes
Verify the specific ordering suffix against official Microchip documentation to confirm exact electrical characteristics and packaging details. Ensure compatibility with existing thermal management solutions and mounting hardware specifications before procurement. Cross-reference datasheet revisions to guarantee alignment with current manufacturing standards.
Selection Notes
Select this component for applications requiring high blocking voltage and low switching losses. Evaluate thermal resistance requirements based on ambient conditions and heat sink capabilities. Confirm that the dual parallel topology meets the specific circuit architecture needs without additional external components.
Part Context
This part belongs to Microchip's Silicon Carbide Schottky Diode Module series. These modules are designed for high-power density applications where efficiency and reliability are critical. The SOT-227 form factor offers a balance between performance and ease of integration into standard power electronics assemblies.
Replacement Considerations
Consult official substitution lists for compatible alternatives. Verify pinout compatibility and thermal interface dimensions when considering cross-brand replacements.
