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The MSCDC200KK170D1PAG is a Silicon Carbide (SiC) Schottky diode module manufactured by Microchip Technology. It features a dual configuration with a reverse voltage rating of 1.7 kV and a forward current capacity of 200 A. The device exhibits a forward voltage of 1.5 V and operates within a temperature range from -40°C to +125°C. Designed for chassis mounting, this component utilizes SiC technology to ensure zero reverse recovery and zero forward recovery characteristics.
Verify the specific ordering suffix against the official Microchip datasheet to confirm pinout compatibility and thermal interface requirements. Ensure that the chassis mounting hardware matches the mechanical specifications provided in the package dimensions section of the product documentation before finalizing procurement orders.
Select this component when designing circuits requiring high-voltage blocking capabilities combined with low switching losses. The SiC material choice supports operation at elevated temperatures and higher frequencies compared to traditional silicon devices. Evaluate the thermal management solution to maintain junction temperatures within the specified operational limits during peak load conditions.
This module belongs to the MSCDC series of SiC Schottky diode modules from Microchip Technology. These components are engineered for demanding power electronics applications where efficiency and reliability are critical. The series offers various voltage and current ratings to accommodate different system architectures and performance requirements.
Consult the official Microchip cross-reference guide or contact technical support for verified substitute part numbers. Do not assume functional equivalence with other manufacturers' modules without validating electrical parameters and mechanical fit through direct datasheet comparison.
The MSCDC200KK170D1PAG features both zero reverse recovery and zero forward recovery characteristics due to its Silicon Carbide Schottky construction.
The device is designed for chassis mounting, utilizing a specific package form factor detailed in the mechanical drawings of the datasheet.