MSCSM120SKM11CT3AG

Power Driver Modules Overview

The MSCSM120SKM11CT3AG is a Silicon Carbide (SiC) discrete power module manufactured by Microchip Technology. It integrates an N-channel MOSFET and a SiC Schottky Barrier Diode (SBD) within a SP3F package designed for press-in PCB mounting. The device features a drain-source breakdown voltage of 1.2 kV and a continuous drain current rating of 254 A, with a maximum power dissipation of 1.067 kW. Electrical characteristics include a typical on-resistance of 11 mΩ, forward voltage of 1.5 V, rise time of 30 ns, fall time of 25 ns, turn-on delay of 30 ns, and turn-off delay of 50 ns. The gate-source voltage range is -10 V to +25 V, with a threshold voltage of 1.8 V. Operating temperature spans from -40°C to +125°C.

Power Driver Modules Feature Summary

• Utilizes Silicon Carbide technology for high thermal conductivity and zero reverse recovery charge.
• Integrates MOSFET and SBD in a single low-inductance SP3F package.
• Designed for press-in PCB mounting to reduce assembly time and improve reliability.

Power Driver Modules Applications

• High-frequency motor drives
• Industrial power supplies
• Uninterruptible power systems

Power Driver Modules Procurement Notes

Verify the specific package variant upon ordering, as the model designation indicates press-in PCB mounting compatibility. Confirm that the SP3F footprint matches the target PCB design requirements. Ensure thermal management solutions support the specified 1.067 kW power dissipation capability. Check RoHS compliance status through official documentation before integration into regulated products.

Power Driver Modules Selection Notes

Select this component for applications requiring high efficiency and compact size due to SiC material properties. The 1.2 kV rating suits medium-voltage industrial environments. Consider the 254 A current capacity for load requirements. Evaluate the SP3F form factor against available board space and mounting constraints compared to screw-mount alternatives.

Power Driver Modules Part Context

This module belongs to the MSCSM120 series of SiC power modules from Microchip Technology. The series offers various configurations including full-bridge and phase-arm topologies. The SP3F package family provides options for both screw and press-in mounting styles, catering to different manufacturing and reliability needs in power electronics designs.

Power Driver Modules Replacement Considerations

Direct substitutes within the same series include MSCSM120HM31CT3AG and MSCSM120AM50CT1AG. Note that these alternatives may differ in current ratings, on-resistance values, or mounting styles. Verify electrical parameters and mechanical dimensions before swapping components to ensure circuit compatibility.