MSCSM120XM31CTYZBNMG

Power Driver Modules Overview

The MSCSM120XM31CTYZBNMG is a three-phase bridge, brake, soft start, and solenoid power module manufactured by Microchip Technology. It integrates six Silicon Carbide (SiC) MOSFETs, six SiC Schottky diodes, one IGBT for soft start, two IGBTs for solenoid control, and associated shunts. The SiC MOSFETs feature a drain-source voltage of 1200 V, continuous current of 80 A at 25 °C, and on-resistance of 31 mΩ. The soft start IGBT supports 180 A continuous current with 1200 V blocking. Solenoid IGBTs handle 27 A continuous current. The module includes an internal PTC thermistor for temperature monitoring.

Power Driver Modules Feature Summary

• Integrates SiC MOSFETs and SiC Schottky diodes for the three-phase bridge to enable high-frequency switching and low conduction losses.
• Includes dedicated IGBT sections for soft start and solenoid applications within a single isolated package.
• Features a silicon nitride substrate and aluminum silicon carbide base plate for improved thermal performance and reliability.
• Incorporates an internal thermistor for precise junction temperature monitoring.

Power Driver Modules Applications

• Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) systems
• High reliability Power Core Module (PCM)
• Modular power module for Power Drive Electronic (PDE)

Power Driver Modules Procurement Notes

Verify the specific ordering suffix against the official datasheet to confirm pinout and terminal configuration. Ensure electrostatic discharge handling procedures are followed during installation. Confirm that the mounting torque specifications for M2.5 and M6 terminals match the mechanical design requirements. Validate isolation voltage ratings relative to the application's electrical safety standards.

Power Driver Modules Selection Notes

Select this module when a combined solution for three-phase drive, braking, and auxiliary functions is required. The integrated SiC technology offers superior thermal management compared to traditional silicon devices. Consider the specific current ratings for the soft start and solenoid sections if those functions are utilized in the design. Verify compatibility with the intended gate drive voltages and thermal interface materials.

Power Driver Modules Part Context

This component belongs to Microchip's Hybrid Power Device family, designed for aerospace and industrial actuation. It consolidates multiple power stages into a single compact form factor. The use of wide-bandgap semiconductors allows for higher operating temperatures and efficiency. The module is engineered for direct heatsink mounting in isolated configurations.

Power Driver Modules Replacement Considerations

Public confirmed substitute part numbers: None available in verified documentation.

Power Driver Modules FAQ

What is the maximum operating junction temperature?

The maximum operating junction temperature is 175 °C.

Does the module include current sensing capabilities?

Yes, the module integrates electrical shunts (R7 to R11) for current measurement.

How is the junction temperature monitored?

An internal Positive Temperature Coefficient (PTC) thermistor is included for temperature monitoring.