MSCSM70XM19CTYZBNMG

Power Driver Modules Overview

The MSCSM70XM19CTYZBNMG is a three-phase bridge, brake, soft start, and solenoid power module. It integrates SiC MOSFETs (Q1-Q6, Q8), SiC diodes (CR1-CR8), an IGBT for soft start (Q7), and high-voltage IGBTs for solenoids (Q9, Q10). The SiC MOSFETs feature a 700V drain-source voltage rating and a maximum continuous current of 110A at 25°C. The device includes internal electrical shunts and a PTC temperature sensor.

Power Driver Modules Feature Summary

• Integrates Silicon Carbide MOSFETs and Schottky Diodes for the three-phase bridge and brake circuits.
• Includes dedicated Silicon Carbide diodes and IGBTs specifically configured for soft start and solenoid applications.
• Features an AlSiC base plate and Si3N4 substrate to provide low thermal resistance and improved heat dissipation.
• Incorporates an internal thermistor for precise junction temperature monitoring.

Power Driver Modules Applications

• Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) systems
• High reliability Power Core Module (PCM)
• Modular power module for Power Drive Electronic (PDE)

Power Driver Modules Procurement Notes

Verify component authenticity by cross-referencing the part number with official Microchip Technology documentation. Confirm that the specific ordering suffix matches the required package and material specifications. Ensure handling procedures account for electrostatic discharge sensitivity as indicated in the datasheet precautions.

Power Driver Modules Selection Notes

Select this module when a combined solution for three-phase drive, braking, and solenoid control is required. The integrated design reduces system complexity compared to discrete components. Verify that the operating case temperature remains within the specified range to maintain performance and longevity.

Power Driver Modules Part Context

This component belongs to the MSCSM series of power modules from Microchip Technology. It utilizes advanced silicon carbide technology to achieve high efficiency and ruggedness. The module consolidates multiple switching functions into a single isolated package suitable for demanding industrial environments.

Power Driver Modules Replacement Considerations

Consult the official Microchip Technology product selector or datasheet revision history to identify verified substitute part numbers. Do not assume functional equivalence with other packages without verifying pinout and electrical ratings.

Power Driver Modules FAQ

What is the isolation voltage rating between terminals and the case?

The RMS isolation voltage from any terminal to the case is rated at 4000 V for one minute at 1 bar pressure.

How does the module monitor internal temperature?

The device contains an internal PTC thermistor with a resistance of 1000 Ω at 0 °C to facilitate temperature monitoring.

What materials are used for the base plate and substrate?

The module uses an AlSiC base plate for weight reduction and reliability, along with a Si3N4 substrate for improved thermal performance.