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MSDM200-16 is listed in the Bridge Rectifier range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is BRIDGE RECT 3P 1.6KV 200A M3-1. Review the specifications below when checking this part for your BOM.
The MSDM200-16 is a glass passivated three-phase rectifier bridge manufactured by Microsemi Corporation. It features a maximum repetitive peak reverse voltage of 1600 V and an average forward rectified current of 200 A per leg. The device utilizes a base-mounted module configuration with isolated terminals for thermal management. Key electrical characteristics include a maximum non-repetitive peak surge current of 3500 A at 8.3 ms single half-sine wave and a maximum DC blocking leakage current of 1 mA at rated voltage. The unit operates within a junction temperature range of -40°C to +150°C.
Verify the specific suffix codes against the official Microsemi datasheet to confirm voltage ratings and pin configurations. Ensure that the procurement channel provides traceability documentation, as this component is often specified for high-reliability industrial environments. Confirm package compatibility with existing thermal management solutions before ordering.
Select this component when designing three-phase rectification stages requiring high current handling and robust voltage withstand capabilities. Compare the 200 A current rating and 1600 V blocking voltage against system load requirements. Evaluate the thermal resistance characteristics to determine appropriate heatsinking strategies for continuous operation under expected ambient conditions.
The MSDM200-16 belongs to the MSD series of glass passivated three-phase rectifier bridges from Microsemi. This series is engineered for demanding power electronics applications where reliability and high current density are critical. It serves as a core component in converting AC input to stable DC output for heavy-duty industrial machinery.
Direct replacements must match the 200 A current rating, 1600 V reverse voltage, and M2-1 or equivalent base-mount package dimensions. Verify that alternative manufacturers offer comparable thermal performance and isolation voltage ratings to ensure circuit integrity without redesigning the mechanical assembly.
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