MT28EW256ABA1LPC-0SIT TR

Memory IC Overview

The MT28EW256ABA1LPC-0SIT TR is a 256-Mbit (32M x 8) synchronous dynamic random-access memory (SDRAM) component manufactured by Micron Technology. It operates at a core voltage of 2.7V to 3.0V and supports data rates up to 133 MHz. The device utilizes a low-profile TSOP-II package with 48 pins, designed for space-constrained applications. Key electrical characteristics include a tRC access time of 7.5 ns and a tRCD of 7.5 ns. It features burst lengths of 1, 2, 4, or 8, and supports page mode operations.

Memory IC Feature Summary

• Supports high-speed synchronous DRAM operations with programmable burst lengths and page modes.
• Operates within a standard 2.7V to 3.0V power supply range for compatibility with various logic families.
• Utilizes a compact 48-pin TSOP-II package to minimize board space requirements.

Memory IC Applications

• Portable consumer electronics requiring dense memory storage
• Industrial control systems with limited physical footprint
• Embedded computing modules needing reliable SDRAM performance

Memory IC Procurement Notes

Verify the exact suffix 'TR' indicates tape-and-reel packaging configuration when sourcing. Confirm the '0SIT' designation matches the specific speed grade and temperature range required for your design. Ensure compatibility with existing PCB footprints for the 48-pin TSOP-II package. Cross-reference the manufacturer's latest datasheet for any updates on recommended operating conditions.

Memory IC Selection Notes

Select this component when a 32M x 8 density is required in a low-profile form factor. Consider the 133 MHz maximum frequency for bandwidth needs. Evaluate the 2.7V-3.0V VCC requirement against system power rails. The TSOP-II package is suitable for through-hole assembly processes where surface-mount alternatives are not feasible.

Memory IC Part Context

This part belongs to Micron's synchronous DRAM family, specifically designed for general-purpose memory applications. It complements other devices in the series offering varying densities and package types. The technology focuses on balancing performance, power consumption, and physical size for embedded systems.

Memory IC Replacement Considerations

Check for direct pin-compatible substitutes from Micron with identical density and speed grades. Verify that alternative packages maintain the same electrical specifications and thermal characteristics. Ensure any replacement supports the same burst length configurations and command set.