MT29C4G48MAZBAAKQ-5 WT TR

Memory IC Overview

The MT29C4G48MAZBAAKQ-5 WT TR is a NAND Flash and Mobile LPDDR multichip package (MCP) designed for TI OMAP applications. It integrates a 4Gb SLC NAND Flash with an organization of 512M x 8 bits and a 2Gb Mobile LPDDR DRAM organized as 64M x 32 bits. The device utilizes a 168-ball WFBGA package (Package Code KQ). It supports low-voltage operation ranging from 1.70V to 1.95V and operates within the wireless temperature range of -25°C to +85°C.

Memory IC Feature Summary

• Space-saving Package-on-Package (PoP) architecture integrating NAND Flash and LPDDR in a single assembly
• Separate asynchronous NAND Flash interface and Mobile LPDDR interface for independent control
• LPDDR features including partial-array self refresh (PASR), deep power-down mode, and programmable burst lengths
• NAND Flash support for two-plane operations, internal ECC, and block lock capabilities

Memory IC Applications

• TI OMAP-based mobile devices
• Wireless communication equipment
• Portable media players
• Smartphones and feature phones

Memory IC Procurement Notes

Verify the specific ordering suffix 'WT' against official Micron documentation to confirm the wireless temperature range (-25°C to +85°C) and voltage specifications. Confirm that the 'TR' suffix indicates tape-and-reel packaging if required by your manufacturing process. Ensure compatibility with the 168-ball WFBGA footprint on your PCB layout.

Memory IC Selection Notes

Select this component when designing systems based on the TI OMAP platform requiring high-density storage and memory in a compact form factor. Consider the 168-ball WFBGA package dimensions and the specific low-voltage requirements (1.70–1.95V) during power budgeting. Verify that the system design accommodates the separate interfaces for the NAND and LPDDR components.

Memory IC Part Context

This part belongs to the Micron MT29C series of NAND Flash and LPDDR MCPs specifically optimized for Texas Instruments OMAP processors. It represents a generation of integrated memory solutions aimed at reducing PCB space and simplifying board design for mobile applications. The device combines non-volatile storage with volatile memory to support complex operating systems and applications.

Memory IC Replacement Considerations

Consult Micron's official cross-reference tools or contact the manufacturer directly for verified substitute part numbers. Do not assume functional equivalence with other MCPs without verifying pinout, electrical characteristics, and software compatibility.