MT29F256G08CKCABH2-12Z:A TR

Memory IC Overview

The MT29F256G08CKCABH2-12Z:A TR is a 256 Gbit NAND Flash memory component manufactured by Micron Technology Inc. It features a 32G x 8 organization and utilizes an asynchronous parallel interface. The device operates within a supply voltage range of 2.7V to 3.6V and supports a clock frequency of up to 83 MHz. It is housed in a 100-ball TBGA package, designed for high-density data storage applications requiring reliable non-volatile memory solutions.

Memory IC Feature Summary

• Supports Open NAND Flash Interface (ONFI) 2.2 compliance
• Utilizes Multiple-Level Cell (MLC) technology for increased density
• Provides synchronous I/O performance capabilities
• Features dual-plane architecture with defined block and page sizes

Memory IC Applications

• Portable computing devices
• Network infrastructure equipment
• Server storage systems

Memory IC Procurement Notes

Verify the specific suffix 'TR' indicates tape-and-reel packaging configuration when sourcing. Confirm the '12' speed grade matches system timing requirements. Ensure compatibility with ONFI 2.2 standards during integration. Validate RoHS compliance status through official manufacturer documentation prior to procurement.

Memory IC Selection Notes

Select this component for designs requiring 256 Gbit capacity with parallel interface constraints. Consider the TBGA package for board space optimization. Evaluate thermal management needs due to MLC technology characteristics. Compare against synchronous variants if higher throughput is required.

Memory IC Part Context

This part belongs to Micron's 256Gb NAND Flash family, sharing architectural similarities with models like MT29F256G08CJAAAWP and MT29F256G08CMCABC5. These components generally offer comparable organizational structures and interface protocols, differing primarily in package type and speed grades.

Memory IC Replacement Considerations

Direct substitutes include MT29F256G08CJAAAWP and MT29F256G08CMCABC5. Verify pinout compatibility and electrical specifications before substitution. Package differences may require PCB redesign.