Memory IC MT29F256G08CMCABH2-12ITZ:A product image

MT29F256G08CMCABH2-12ITZ:A

  • Description:IC FLASH 256GBIT PAR 100TBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:576d6c8258e3 Category: Brand:

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MT29F256G08CMCABH2-12ITZ:A is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC FLASH 256GBIT PAR 100TBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT29F256G08CMCABH2-12ITZ:A

  • Description:IC FLASH 256GBIT PAR 100TBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (MLC)
  • Memory Size:256Gbit
  • Memory Organization:32G x 8
  • Memory Interface:Parallel
  • Clock Frequency:83 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:100-TBGA
  • Supplier Device Package:100-TBGA (12x18)

Memory IC datasheet and documents for MT29F256G08CMCABH2-12ITZ:A

MT29F256G08CMCABH2-12ITZ:A

Memory IC Overview

The MT29F256G08CMCABH2-12ITZ:A is a 256Gb (32G x 8) NAND flash memory component manufactured by Micron Technology. It utilizes Multi-Level Cell (MLC) technology and supports the Open NAND Flash Interface (ONFI) 2.2 standard. The device features an asynchronous interface with a maximum clock frequency of 110 MHz. It operates within a voltage range of 2.7V to 3.6V and is rated for industrial temperatures from -40°C to +85°C. The component is housed in a 52-pin VLGA package.

Memory IC Feature Summary

  • Supports ONFI 2.2-compliant asynchronous I/O operations
  • Utilizes MLC technology for high-density storage
  • Features multiplexed bus for data, addresses, and commands

Memory IC Applications

  • Industrial instrumentation
  • Security equipment
  • Consumer electronics

Memory IC Procurement Notes

Verify the specific suffix 'H2' against official Micron documentation, as it may indicate a specific binning or revision not universally listed in general family datasheets. Confirm the 52-pin VLGA package dimensions match your PCB footprint requirements. Ensure the asynchronous timing mode aligns with your controller's capabilities.

Memory IC Selection Notes

Select this part for applications requiring 256Gb density with asynchronous control interfaces. The industrial temperature range makes it suitable for harsh environments. Compare pinout compatibility with existing designs if replacing older generations. Verify power consumption specifications under active load conditions.

Memory IC Part Context

This component belongs to the Micron MT29F series of NAND flash memories. It shares architectural similarities with other devices in the 64Gb to 512Gb range, such as the MT29F256G08CJAAAWPZ, but differs in package type and specific interface timing characteristics defined by its suffix.

Memory IC Replacement Considerations

Direct substitutes include other Micron 256Gb MLC NAND parts like the MT29F256G08CJAAAWPZ, provided the package and interface timing are compatible. Cross-vendor replacements require careful verification of command sets and electrical parameters.

MT29F256G08CMCABH2-12ITZ:AMT29F256G08CMCABH2-12ITZ:A

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