Memory IC MT29F256G08CMCDBJ5-6R:D product image

MT29F256G08CMCDBJ5-6R:D

  • Description:IC FLASH 256GBIT PAR 132TBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:112e5d11f956 Category: Brand:

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MT29F256G08CMCDBJ5-6R:D is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC FLASH 256GBIT PAR 132TBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT29F256G08CMCDBJ5-6R:D

  • Description:IC FLASH 256GBIT PAR 132TBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (MLC)
  • Memory Size:256Gbit
  • Memory Organization:32G x 8
  • Memory Interface:Parallel
  • Clock Frequency:167 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:-
  • Supplier Device Package:132-TBGA (12x18)

Memory IC datasheet and documents for MT29F256G08CMCDBJ5-6R:D

MT29F256G08CMCDBJ5-6R:D

Memory IC Overview

The MT29F256G08CMCDBJ5-6R:D is a NAND flash memory component manufactured by Micron Technology. It features a storage capacity of 256 Gbit with an organization of 32 Gigawords by 8 bits. The device utilizes Multiple-Level Cell (MLC) technology and supports the Open NAND Flash Interface (ONFI) 2.2 standard. It operates within a temperature range of -40°C to +85°C and is housed in a 52-pin VLGA package.

Memory IC Feature Summary

  • Supports ONFI 2.2 interface for standardized asynchronous and synchronous I/O operations
  • Utilizes MLC technology to provide high-density data storage
  • Designed for industrial operating temperatures ranging from -40°C to +85°C

Memory IC Applications

  • Industrial instrumentation
  • Security equipment
  • Consumer electronics

Memory IC Procurement Notes

Verify the specific suffix 'D' against official Micron documentation to confirm exact timing and package variations. Ensure compatibility with existing system voltage requirements and interface standards before integration. Confirm lead times and authenticity through authorized distribution channels.

Memory IC Selection Notes

Select this component for applications requiring 256 Gbit density in a compact 52-pin form factor. Consider the industrial temperature rating for environments with thermal fluctuations. Evaluate the ONFI 2.2 compliance for controller compatibility.

Memory IC Part Context

This part belongs to the Micron MT29F series of NAND flash memories, which includes various densities and package options. The series is characterized by support for both asynchronous and synchronous modes, catering to diverse embedded storage needs across multiple industries.

MT29F256G08CMCDBJ5-6R:DMT29F256G08CMCDBJ5-6R:D

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