MT29F4G08ABADAH4:D TR

Memory IC Overview

The MT29F4G08ABADAH4:D TR is a 4Gb SLC NAND flash memory integrated circuit manufactured by Micron Technology Inc. It features an 8-bit parallel interface and is organized as 512M x 8. The device operates within a supply voltage range of 1.7V to 1.95V and supports an asynchronous timing type with a maximum clock frequency of 50 MHz. It is housed in a 63-VFBGA package measuring 9x11 mm, suitable for surface mount installation. The component is rated for commercial operating temperatures between 0°C and 70°C.

Memory IC Feature Summary

• Provides non-volatile data storage using Single-Level Cell (SLC) NAND technology.

Memory IC Applications

• Embedded devices requiring high-density storage

Memory IC Procurement Notes

Verify the specific suffix D TR against official Micron documentation to confirm tape-and-reel packaging specifications. Ensure compatibility with the target system's 1.7V-1.95V power supply requirements. Confirm that the 63-VFBGA footprint matches the printed circuit board design. Validate RoHS compliance status for the intended market regulations.

Memory IC Selection Notes

Select this component when a compact 4Gb capacity with an 8-bit parallel interface is required. The low voltage operation at 1.7V-1.95V makes it suitable for portable applications. The VFBGA package offers a small form factor for space-constrained designs. Verify that the commercial temperature range meets the operational environment needs.

Memory IC Part Context

This part belongs to the Micron MT29F series of NAND flash memories. The series utilizes advanced process technologies to deliver reliable storage solutions. The specific model indicates an 8-bit bus width and a 4Gb density level. It is designed for general-purpose storage applications where cost-effective, high-density memory is essential.

Memory IC Replacement Considerations

Consult Micron datasheets for direct pin-compatible alternatives within the MT29F series. Verify electrical parameters such as voltage and interface speed before substitution. Cross-reference package dimensions to ensure mechanical fit.