Memory IC MT29F8G16ABBCAM71M3WC1 product image

MT29F8G16ABBCAM71M3WC1

  • Description:IC FLASH 8GBIT PARALLEL DIE
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Bulk

SKU:bef6856a6b19 Category: Brand:

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MT29F8G16ABBCAM71M3WC1 is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC FLASH 8GBIT PARALLEL DIE. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT29F8G16ABBCAM71M3WC1

  • Description:IC FLASH 8GBIT PARALLEL DIE
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Bulk
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND
  • Memory Size:8Gbit
  • Memory Organization:512M x 16
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.95V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die

Memory IC datasheet and documents for MT29F8G16ABBCAM71M3WC1

MT29F8G16ABBCAM71M3WC1

Memory IC Overview

The MT29F8G16ABBCAM71M3WC1 is a NAND flash memory integrated circuit manufactured by Micron Technology Inc. It provides a total storage capacity of 8 Gigabits, organized as 512 Megawords by 16 bits. The device utilizes a parallel interface for data transfer and operates within an ambient temperature range of 0°C to 70°C. This component is classified as obsolete in current product listings.

Memory IC Feature Summary

  • Provides 8Gb non-volatile storage capacity with x16 bit organization
  • Utilizes parallel interface architecture for data access
  • Operates within standard commercial temperature specifications

Memory IC Applications

  • Data storage systems requiring 8Gb capacity
  • Embedded applications utilizing parallel NAND interfaces
  • Commercial grade electronic devices

Memory IC Procurement Notes

Verify the obsolete status of this specific part number before initiating any procurement activities. Confirm that the x16-bit organization aligns with system requirements, as alternative x8 variants may be available. Ensure compatibility with existing parallel interface designs given the discontinued nature of this component.

Memory IC Selection Notes

Select this component only if the design specifically requires an 8Gb capacity with x16-bit width and parallel connectivity. Evaluate the impact of its obsolete status on long-term supply chain stability. Consider whether newer generations or alternative organizations meet the functional requirements without necessitating hardware redesign.

Memory IC Part Context

This part belongs to Micron's NAND flash memory portfolio, designed for high-density data storage. It represents a specific configuration within the broader family of 8Gb devices, distinguished by its 16-bit bus width and parallel interface type, catering to legacy or specific embedded system architectures.

MT29F8G16ABBCAM71M3WC1MT29F8G16ABBCAM71M3WC1

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