MT29F8T08EWLEEM5-T:E

Memory IC Overview

The MT29F8T08EWLEEM5-T:E is an 8 Tbit NAND flash memory integrated circuit manufactured by Micron Technology Inc. This component utilizes Triple-Level Cell (TLC) technology to achieve high storage density within a compact footprint. It features a parallel interface with a x8 data width, compatible with ONFi standards for broad interoperability. The device is housed in a 16-die LBGA package, supporting low-power operations suitable for embedded applications requiring reliable non-volatile data retention.

Memory IC Feature Summary

• Utilizes Triple-Level Cell (TLC) architecture for enhanced storage density
• Supports parallel x8 data interface with ONFi compatibility
• Non-volatile storage capability ensuring data retention without power

Memory IC Applications

• Embedded systems requiring high-density non-volatile storage
• Consumer electronics utilizing NAND flash memory
• Industrial control units needing reliable data retention

Memory IC Procurement Notes

This specific part number is scheduled for obsolescence and will be discontinued by the manufacturer. Procurement should verify current availability status carefully as supply may be limited or exhausted. Alternative components from the same family or newer generations must be evaluated for design continuity. Ensure all sourcing channels confirm the obsolete status before initiating any purchase orders to avoid fulfillment failures.

Memory IC Selection Notes

Select this component only if legacy support for the 8 Tbit TLC NAND specification is required. Verify that the system design accommodates the parallel x8 interface and the specific LBGA package dimensions. Consider the end-of-life status when planning long-term production runs. Evaluate pinout compatibility and electrical characteristics against existing board layouts to ensure seamless integration without redesign.

Memory IC Part Context

This device belongs to Micron's NAND flash memory portfolio, designed for mass storage applications. It represents a generation of TLC-based solutions offering cost-effective high-capacity storage. The part integrates controller logic and memory arrays on a single die, simplifying system architecture for manufacturers deploying embedded storage solutions in various electronic devices.

Memory IC Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation due to the obsolescence status. Designers must consult Micron Technology directly for recommended next-generation replacements or equivalent capacity alternatives that maintain interface and form factor compatibility.