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MT29GZ6A6BPIET-53AIT.112 TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC FLASH RAM 8GBIT ONFI 149WFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for MT29GZ6A6BPIET-53AIT.112 TR
- Description：IC FLASH RAM 8GBIT ONFI 149WFBGA
- Series：-
- Mfr：Micron Technology Inc.
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile, Volatile
- Memory Format：FLASH, RAM
- Technology：FLASH - NAND (SLC), DRAM - LPDDR4
- Memory Size：8Gbit (NAND), 8Gbit (LPDDR4)
- Memory Organization：1G x 8 (NAND), 512M x 16 (LPDDR4)
- Memory Interface：ONFI
- Clock Frequency：1866 MHz
- Write Cycle Time - Word, Page：30ns
- Voltage - Supply：1.06V ~ 1.17V, 1.7V ~ 1.95V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：149-VFBGA
- Supplier Device Package：149-VFBGA (8x9.5)
- Access Time：25 ns
- Grade：Automotive
- Qualification：AEC-Q100
Memory IC datasheet and documents for MT29GZ6A6BPIET-53AIT.112 TR
Memory IC Overview
The MT29GZ6A6BPIET-53AIT.112 TR is a multichip package (MCP) manufactured by Micron Technology, integrating MassFlash NAND and LPDDR4 memory technologies. It provides a total storage capacity of 16 Gbit within a VFBGA-149 package designed for surface mount device (SMD/SMT) installation. This component combines non-volatile flash storage with low-power double data rate fourth-generation synchronous dynamic random-access memory to optimize system performance and density.
Memory IC Feature Summary
- Integrates MassFlash NAND and LPDDR4 technologies into a single multichip package structure
- Provides high-density 16 Gbit storage capacity in a compact VFBGA-149 form factor
- Designed for surface mount technology (SMD/SMT) applications to minimize power consumption
Memory IC Applications
- Mobile devices requiring integrated storage and memory solutions
- Embedded systems needing compact multichip packages
- Consumer electronics utilizing NAND and LPDDR4 combinations
Memory IC Procurement Notes
Verify the specific suffix .112 TR against official Micron documentation to confirm tape and reel packaging details. Ensure compatibility with VFBGA-149 footprint requirements during PCB design. Confirm availability status directly with authorized distributors as inventory levels fluctuate. Validate that the MassFlash/LPDDR4 configuration matches system architecture needs before procurement.
Memory IC Selection Notes
Select this component when a compact solution combining NAND flash and LPDDR4 is required. The VFBGA-149 package offers space efficiency for dense board layouts. Consider the 16 Gbit capacity for applications needing moderate storage alongside fast volatile memory. Ensure thermal management supports SMD/SMT mounting constraints.
Memory IC Part Context
This part belongs to Micron's MT29G series of multichip packages. These components typically combine NAND flash with DRAM or LPDDR to enhance system performance. The MT29GZ6A6BPIET variant specifically targets applications benefiting from integrated MassFlash and LPDDR4 technologies.
Memory IC Replacement Considerations
Check for direct substitutes within the MT29GZ6A6BPIET family with different suffixes indicating package or temperature variations. Verify pinout and electrical specifications match exactly before substituting.
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