MT29TZZZ8D6DKEZB-107 W.9H6

Memory IC Overview

The MT29TZZZ8D6DKEZB-107 W.9H6 is a high-density memory component manufactured by Micron Technology Inc., integrating NAND Flash and LPDDR3 DRAM within a single package. This device provides 128Gbit of NAND FLASH capacity alongside 8Gbit of LPDDR3 RAM, designed for storage-intensive applications requiring multimedia and data processing capabilities. It operates with a clock frequency of 933 MHz and supports supply voltages ranging from 1.14V to 1.3V and 1.7V to 1.95V. The component functions within an operating temperature range of -25°C to 85°C and utilizes a 221WFBGA package interface.

Memory IC Feature Summary

• Integrates high-capacity NAND Flash and LPDDR3 DRAM in a unified package
• Optimized for low-power consumption and high-performance operations
• Supports multimedia and data-intensive application requirements

Memory IC Applications

• Multimedia processing systems
• Data storage applications
• Storage-intensive embedded devices

Memory IC Procurement Notes

Verify the obsolete status of this part number before initiating any procurement activities. Confirm that the specific suffixes match your design requirements exactly, as ordering suffixes may indicate variations in packaging or testing standards without altering core functionality. Ensure compatibility with existing system voltage and thermal constraints given the specified operating ranges.

Memory IC Selection Notes

Select this component only if the design requires the specific integration of 128Gbit NAND and 8Gbit LPDDR3 in a 221WFBGA form factor. Evaluate the thermal management capabilities required for the -25°C to 85°C operating range. Consider the availability of alternative solutions due to the obsolete lifecycle status when planning long-term production runs.

Memory IC Part Context

This component belongs to Micron's memory product line, specifically designed for applications needing combined non-volatile and volatile memory resources. The 221WFBGA package allows for compact integration in space-constrained designs. As an obsolete part, it represents a previous generation of integrated memory solutions prior to newer density or interface advancements.

Memory IC Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Due to the obsolete status, direct replacements should be sourced through official Micron Technology channels or authorized distributors who may hold remaining stock or recommend updated equivalent series.