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MT30AZZZCD94TKXL-023 W.237 is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is MODULE. Review the specifications below when checking this part for your BOM.
Memory IC specifications for MT30AZZZCD94TKXL-023 W.237
- Description：MODULE
- Series：-
- Mfr：Micron Technology Inc.
- Package：Bulk
- Memory Type：-
- Memory Format：-
- Technology：-
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for MT30AZZZCD94TKXL-023 W.237
Memory IC Overview
The Micron MT30AZZZCD94TKXL-023 W.237 is a uMCP (Universal Multi-Chip Package) component designed for client storage applications. It integrates NAND flash memory and LPDDR5 DRAM within a single package to provide high-density, low-power data storage solutions. The device supports the UFS 3.1 protocol, enabling efficient command queuing and simultaneous read/write operations. This architecture allows OEMs to optimize PCB space while delivering performance superior to legacy e.MMC standards.
Memory IC Feature Summary
- Integrates TLC NAND and LPDDR5 DRAM in a compact form factor
- Supports UFS 3.1 protocol for advanced command processing
- Optimized for low power consumption in active and sleep modes
Memory IC Applications
- Client SSD designs requiring small footprint
- Mobile devices needing high-density storage
- IoT platforms with strict power constraints
Memory IC Procurement Notes
Verify current availability directly with Micron or authorized distributors as this specific suffix may indicate an obsolete or limited-run configuration. Confirm RoHS compliance and REACH status through official datasheets before integration into production schedules.
Memory IC Selection Notes
Select this part when system design requires a balance of high capacity and low power usage in a constrained physical space. Ensure the host controller supports UFS 3.1 interfaces and LPDDR5 signaling requirements for optimal performance compatibility.
Memory IC Part Context
This component belongs to Micron's uMCP family, which combines multiple memory technologies into a single package. These devices are engineered to replace traditional discrete memory solutions, offering improved reliability and reduced board complexity for modern electronic systems.
Memory IC Replacement Considerations
Consult Micron technical documentation for verified cross-references. Generic substitutes may not match the specific LPDDR5 timing parameters or UFS 3.1 firmware configurations required by the original design.
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