MT30AZZZEDA0TPWL-031 W.20W

Memory IC Overview

The MT30AZZZEDA0TPWL-031 W.20W is a Universal Memory Card Package (uMCP) memory IC manufactured by Micron Technology Inc. It integrates NAND flash and LPDDR5 DRAM within a single multichip package to maximize density and performance while minimizing power consumption. The component offers a total storage capacity of 2 Tbit, with specific configurations including 64 Gbit variants. It utilizes a VFBGA-297 or TFBGA WT package for surface mount installation, designed for high-performance mobile and embedded applications requiring efficient data storage and processing capabilities.

Memory IC Feature Summary

• Integrates NAND flash and LPDDR5 DRAM in a single uMCP structure
• Optimizes system board space through high-density multichip packaging
• Reduces overall power consumption compared to discrete solutions
• Supports high-speed data transfer rates via UFS interface standards

Memory IC Applications

• Smartphones and mobile devices
• Tablets and portable computing devices
• Embedded systems requiring compact memory solutions

Memory IC Procurement Notes

Verify the exact suffix designation (e.g., W.20W vs WN.20W) as these may indicate different tape-and-reel or tray packaging options rather than functional changes. Confirm current lifecycle status directly with Micron, as availability varies by region and distributor. Ensure compatibility with existing PCB footprints for the 297-ball VFBGA/TFBGA package before ordering.

Memory IC Selection Notes

Select this component when system design requires a unified memory solution combining fast volatile access with non-volatile storage in a minimal footprint. Consider the 2 Tbit capacity against available board space and thermal constraints. Verify that the host controller supports the required UFS and LPDDR5 protocols for optimal performance integration.

Memory IC Part Context

This part belongs to Micron's uMCP family, which combines multiple memory technologies into one package. These components are engineered for mobile electronics where size, weight, and power efficiency are critical. The series typically includes various capacity options to suit different market segments from entry-level to flagship devices.

Memory IC Replacement Considerations

Check for direct cross-reference part numbers from Micron with updated suffixes. Evaluate competitors offering similar uMCP configurations with compatible pinouts and electrical specifications. Ensure any substitute maintains the same NAND and DRAM technology nodes for performance parity.